Kulicke and Soffa Industries, Inc. Collaborates with LeYu Precision Co., Ltd. to Deliver Production-Proven Automated Material Handling Systems
September 12, 2022 at 09:05 am EDT
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Kulicke and Soffa Industries, Inc. announced a collaboration with LeYu Precision Co. Ltd. to provide highly automated ball bonder production line solutions utilizing rail guided vehicle (RGV) material handling systems supporting the broad semiconductor market. Automated material handling systems utilize computerized devices and robots which ensure efficient transportation of magazines or carriers between storage buffers and production equipment on the manufacturing floor.
The collaboration has successfully implemented over 140 RGV production lines to date across multiple customer locations. Production efficiency enhancements are enabled through reducing operator interaction and eliminating standby time. In addition to the productivity gains, this automated approach accelerates the customer's path to full production.
These integrated solutions support customers building new facilities as well as for retrofits of existing facilities. Customers are positioned to benefit and rapidly implement a highly automated ball bonder production line that is controlled by an efficient material control scheduler (MCS) and that interfaces directly with the customer's existing manufacturing execution system (MES). The automated material handling system along with K&S's wire bonding solution will debut at SEMICON Taiwan trade show in Taipei, from September 14 through 16, 2022, Booth #L0616 (Level 4).
Kulicke and Soffa Industries, Inc. specializes in developing semiconductor and electronics assembly solutions. It designs, develops, manufactures, and sells capital equipment, consumables and services used to assemble semiconductors and electronic devices, such as integrated circuits, power discrete, light-emitting diode (LEDs), advanced displays and sensors. The Company operates in four segments. Its Ball Bonding Equipment segment is in designs, development, manufacture, and sell of ball bonding equipment and wafer level bonding equipment. Its Wedge Bonding Equipment segment is in design, development, manufacture, and sale of wedge bonding equipment. The Company's Advanced Solutions is in design, development, manufacture, and sells advanced display, die-attach and thermocompression systems and solutions. Its aftermarket products and services segment is in the design, development, manufacture and sale of a variety of tools, spares and services for the Company's equipment.