Lam Research Corporation announced that SK hynix Inc. has selected Lam's innovative dry resist fabrication technology as a development tool of record for two key process steps in the production of advanced DRAM chips. A breakthrough technology introduced by Lam in 2020, dry resist extends the resolution, productivity, and yield of Extreme Ultraviolet (EUV) lithography, a pivotal technology used in the production of next-generation semiconductors. Through Lam's work with SK hynix and ongoing collaboration with ecosystem partners on dry resist technology, the company continues to take a leadership role in driving patterning innovations to remove the roadblocks associated with scaling to future memory nodes with EUV lithography. First developed by Lam in collaboration with ASML and IMEC, dry resist technology offers several advantages over conventional chemically amplified resist patterning for EUV lithography. Dry resist technology solutions significantly enhance EUV sensitivity and the resolution of each wafer pass, enabling patterns to better adhere to the wafer and improving performance and yield. In addition, Lam's dry resist development approach offers key sustainability benefits by consuming less energy and five to ten times less raw materials than traditional chemical wet resist processes.