Related Information of the Company's 2022 Q2
Consolidated Financial Report
Date of events
2022/07/26
To which item it meets
paragraph 31
Statement
1.Date of submission to the board of directors or approval by the board of
directors:2022/07/26
2.Date of approval by the audit committee:2022/07/26
3.Start and end dates of financial reports or annual self-assessed financial
information of the reporting period (XXXX/XX/XX~XXXX/XX/XX):
2022/01/01~2022/06/30
4.Operating revenue accumulated from 1/1 to end of the period
(thousand NTD):22,938,003
5.Gross profit (loss) from operations accumulated from 1/1 to end of
the period (thousand NTD):11,068,827
6.Net operating income (loss) accumulated from 1/1 to end of the period
(thousand NTD):6,197,831
7.Profit (loss) before tax accumulated from 1/1 to end of the period
(thousand NTD):6,795,188
8.Profit (loss) accumulated from 1/1 to end of the period
(thousand NTD):5,864,398
9.Profit (loss) during the period attributable to owners of parent
accumulated from 1/1 to end of the period (thousand NTD):5,864,453
10.Basic earnings (loss) per share accumulated from 1/1 to end of
the period (NTD):3.17
11.Total assets end of the period (thousand NTD):83,721,685
12.Total liabilities end of the period
(thousand NTD):34,844,872
13.Equity attributable to owners of parent end of the
period (thousand NTD):48,876,178
14.Any other matters that need to be specified:None
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Macronix International Co. Ltd. published this content on 26 July 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 26 July 2022 09:58:04 UTC.
MACRONIX INTERNATIONAL CO., LTD. is a Taiwan-based company principally engaged in the design, manufacture and distribution of integrated circuits (ICs) and memory chips. The Company mainly provides non-volatile memory ICs, including mask read only memory (ROM) products and Xtra ROM products, as well as NOR flash products and NAND flash products. The Company is also engaged in the provision of wafer foundry services, including sub-micron logic processing, high-pressure complementary metal oxide semiconductor (CMOS) processing, embedded ROM processing and other services. The Company distributes its products within the domestic market and to overseas markets, including Japan, America, Europe and the rest of Asia.