05/27/2021 09:00:00 CEST Manz AG receives follow-up order for equipment to realize fan-out panel level packaging in microchip production
May 27, 2021 at 03:09 am EDT
Share
05/27/2021 09:00:00 CEST, Reutlingen Order in the mid-single-digit million euro range from one of the world's leading microchip producers | Megatrends of digitalization, electromobility and autonomous driving spur market growth | CAGR of >20% expected for plant technology until 2024
Manz AG, a globally active high-tech equipment manufacturer with a comprehensive technology portfolio, is seeing increasing interest in equipment for realizing the innovative packaging process for microchips, Fan-Out Panel Level Packaging (FOPLP). Now, Manz has received a follow-up order in the mid-single-digit million euro range from one of the world's leading providers in the field of microchip manufacturing.
Martin Drasch, CEO of Manz AG, comments: 'The electronics industry is currently characterized by high dynamics, especially against the background of rapid digitization. A basic prerequisite for this is increasing miniaturization, which means that increasingly smaller components have an increasingly greater performance capacity. In the automotive industry in particular, the megatrends of electromobility and autonomous driving will lead to a sharp rise in the number of chips installed. Here, our systems for the realization of fan-out panel level packaging will play a key role. This is because, in addition to a significant reduction in volume, thickness, weight and manufacturing costs of the packaging, FOPLP also has a significantly positive impact on the thermal conduction and speed of the components.'
In recent years electromobility and autonomous driving have already led to a sharp increase in the number of sensors installed in cars. While in 2016 sensors amounted to between 60 and 100 per car, by 2020 there were already more than 200 sensors. The number of chips in smartphones has also increased enormously. In view of these developments, suppliers in the fan-out panel level packaging sector can expect strong revenue growth for production equipment of more than 20% per year in the coming years.
'With our integrated and automated production solutions, we as a high-tech equipment manufacturer create the basis for a fast time-to-market while at the same time improving the performance parameters of the end products and reducing production costs. These are clear competitive advantages for our customers and a very good position for us to benefit from the market potential,' Martin Drasch summarizes.
Back to overview
Attachments
Original document
Permalink
Disclaimer
Manz AG published this content on 27 May 2021 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 27 May 2021 07:08:01 UTC.
Manz AG is a Germany-based company engaged in manufacturing high-tech equipment. The Company's business activities are divided into five segments: Solar, Electronics, Energy Storage, Contract Manufacturing, and Service. The Company specializes in automation, vision and metrology, laser processing, wet chemistry, and roll-to-roll processes. It offers manufacturers and their suppliers manufacturing solutions in the areas of photovoltaics, electronics and lithium-ion battery technology. The Company's product portfolio includes both customer-specific developments and standardized machines and modules that can be linked together to form individual system solutions. The Company operates globally, with development and production facilities in Germany, Slovakia, Hungary, Italy, China and Taiwan, as well as sales and service branches in the United States and India.
MANZ AG 
