Murata Manufacturing Co., Ltd. and Cooler Master Co., Ltd. have jointly developed a 200 µm vapor chamber, the world's thinnest heat dissipator for electronic devices. This is the first product to result from the joint development partnership between Murata, which brings expertise in designing compact electronic components, and Cooler Master, a leader in heat dissipators for electronic devices. Both companies are committed to strengthening their partnership moving forward as they work to create new products that solve heat-related problems affecting next-generation devices. Using Murata's technology and expertise in electronic components, mainly for communication applications, the new product was designed to be the world's thinnest vapor chamber at only 200 µm thick. It can be mounted in very small interior spaces yet provides efficient dispersion and dissipation of heat from components such as ICs, thereby improving the operating stability of compact electronic devices. The 200 µm vapor chamber will be manufactured at Cooler Master's factory, benefiting from their extensive expertise in producing heat dissipators for a variety of electronic devices, and will be widely marketed as a product bearing the Cooler Master brand. Structure of vapor chamber, a cooling liquid (operating fluid) is enclosed between overlapping layers of thin metal foil. The operating fluid absorbs heat from the heat source, causing it to evaporate, and this vapor is dispersed within the vapor chamber, dissipating the heat. As the heat is dissipated, the vapor recondenses into liquid to be circulated back to the heat source via a wick containing minute gaps.