NICHE-TECH SEMICONDUCTOR MATERIALS LIMITED

Niche-Tech Semiconductor Materials Limited

8490

KYG6541R1065

Specialty Mining & Metals

Market Closed - Hong Kong S.E. Other stock markets 04:09:09 2024-04-25 am EDT			5-day change	1st Jan Change
0.157 ^HKD	+12.14%		+6.08%	+12.95%

Apr. 18	Niche-Tech Semiconductor Materials Limited Not to Recommend the Payment of Final Dividend for the Year Ended 31 December 2023	CI
Mar. 28	Niche-Tech Semiconductor Materials Limited Reports Earnings Results for the Full Year Ended December 31, 2023	CI

Niche-Tech Group Limited Proposes Final Dividend for the Year Ended December 31, 2021

May 12, 2022 at 04:40 am EDT

Niche-Tech Group Limited announced that the annual general meeting to be held on June 15, 2022 to declare a final dividend of HKD 0.0019 per share for the year ended December 31, 2021.

Latest news about Niche-Tech Semiconductor Materials Limited

Niche-Tech Semiconductor Materials Limited Not to Recommend the Payment of Final Dividend for the Year Ended 31 December 2023	Apr. 18	CI
Niche-Tech Semiconductor Materials Limited Reports Earnings Results for the Full Year Ended December 31, 2023	Mar. 28	CI
Niche-Tech Semiconductor Materials Limited Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023	Nov. 08	CI
Niche-Tech Semiconductor Materials Limited Announces Not Recommend an Interim Dividend for the Year Ending 31 December 2023	23-08-11	CI
Niche-Tech Semiconductor Materials Limited Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023	23-08-09	CI
Niche-Tech Semiconductor Materials Limited Approves Final Dividend for the Ended 31 December 2022	23-06-14	CI
Niche-Tech Semiconductor Materials Limited Reports Earnings Results for the First Quarter Ended March 31, 2023	23-05-08	CI
Niche-Tech Semiconductor Materials Limited Proposes Ordinary Final Dividend for the Year Ended December 31, 2022, Payable on July 13, 2023	23-04-25	CI
Niche-Tech Group Limited Proposes Final Dividend for the Year Ended December 31, 2022, Payable on 13 July 2023	23-03-24	CI
Niche-Tech Semiconductor Materials Limited Provides Unaudited Consolidated Earnings Guidance for the Year Ended 31 December 2022	23-03-13	CI
Niche-Tech Semiconductor Materials Limited Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2022	22-11-08	CI
Niche-Tech Group Limited has Changed its Name to Niche-Tech Semiconductor Materials Limited	22-09-07	CI
Niche-Tech Group Limited Announces Declaration of Interim Dividend for the Year Ending 31 December 2022, Payable on October 14, 2022	22-08-09	CI
Niche-Tech Group Limited Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2022	22-08-09	CI
Niche-Tech Group Limited Provides Preliminary Unaudited Consolidated Group Earnings Guidance for the Six Months Ended 30 June 2022	22-07-28	CI
Niche-Tech Group Limited Approves Final Dividend for the Year Ended 31 December 2021	22-06-15	CI
Niche-Tech Group Limited Proposes Final Dividend for the Year Ended December 31, 2021	22-05-12	CI
Niche-Tech Group Limited Reports Earnings Results for the First Quarter Ended March 31, 2022	22-05-06	CI
Niche-Tech Group Limited Provides Earnings Guidance for the Three Months Ended 31 March 2022	22-04-27	CI
Niche-Tech Group Limited Proposes Final Dividend for the Year Ended December 31, 2021, Payable on July 8, 2022	22-03-24	CI
Niche-Tech Group Limited Reports Earnings Results for the Full Year Ended December 31, 2021	22-03-24	CI
Niche-Tech Group Limited Provides Group Earnings Guidance for the Year Ended 31 December 2021	22-03-15	CI
Niche-Tech Group Limited Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2021	21-11-08	CI
Niche-Tech Group Limited Provides Earnings Guidance for the Nine Months Ended 30 September 2021	21-10-28	CI
Niche-Tech Group Limited Declares Interim Dividend for the Year Ending 31 December 2021, Payable on or Around 3 September 2021	21-08-13	CI

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Niche-Tech Semiconductor Materials Ltd, formerly Niche-Tech Group Limited, is an investment holding company mainly engaged in the semiconductor packaging materials business. The Company is engaged in the development, production and sale of bonding wires, encapsulants and other products. The bonding wires include palladium plated copper wires, silver alloy wires, copper alloy wires, silicon aluminum wires, gold alloy wires and other products. The encapsulants include light-emitting diode (LED) encapsulation silicone, epoxy and other products. The Company is also engaged in the production and sale of die attach adhesives, soldering materials and other products.

Sector

Specialty Mining & Metals

Calendar

2024-05-06 - Q1 2024 Earnings Release (Projected)

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Sector Nonferrous Metal Processing

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