Nordson Electronics Solutions has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson's customer, Powertech Technology Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. For details about this solution developed in late 2024 and 2025, download the case study here: Customer Success: Powertech Technology Inc. (PTI) Advances Panel Level Packaging with Nordson.
Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
Published on 06/11/2025 at 02:50
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