Onto Innovation Inc. (NYSE: ONTO) today announced that company management is scheduled to participate in the 8th Annual NYC Summit 2019, being held December 17, 2019 at the Parker New York Hotel, New York City.

The presentation material utilized during the NYC Summit will be made accessible on the investor page of the company’s website.

About The 8th Annual NYC Summit

The NYC Summit is hosted by executive management from participating companies and will feature a “round-robin” format consisting of small group meetings, each 30 minutes in duration. During the event, investors and analysts will have the opportunity to meet with up to 10 of the 16 management teams during the 30-minute group meeting sessions, as well as opportunities to meet with additional management teams during the breakfast and lunch networking sessions.

The 16 management teams collectively hosting the 2019 NYC Summit include: ACM Research (ACMR), Advanced Energy Industries (AEIS), Aehr Test (AEHR), Alpha & Omega Semiconductor (AOSL), Axcelis (ACLS), BE Semiconductor Industries (BESI.AS), Brooks (BRKS), Cohu (COHU), FormFactor (FORM), Ichor Systems (ICHR), Intevac (IVAC), Kulicke & Soffa (KLIC), Onto Innovation (ONTO — formerly NANO/RTEC), PDF Solutions (PDFS), Photon Control (PHO.TO), and Veeco Instruments (VECO). Cowen is sponsoring the networking luncheon.

The NYC Summit is by invitation only and is open to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. Last day for registration is December 6, 2019.

RSVP Contacts for 8th Annual NYC Summit 2019

To RSVP for the NYC Summit, please contact either of the Summit’s co-chairs.

Laura J. Guerrant-Oiye

Guerrant Associates

Phone: (808) 960-2642

Email: laura@guerrantir.com

      

Claire E. McAdams

Headgate Partners LLC

Phone: (530) 265-9899

Email: claire@headgatepartners.com

About Onto Innovation Inc.

Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization. Additional information can be found at www.ontoinnovation.com.

Source: Onto Innovation Inc.