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    6723   JP3164720009

RENESAS ELECTRONICS CORPORATION

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Renesas Electronics Corporation Announces Development of Next-Generation Wireless MCUs Supporting New Bluetooth? 5.3 Low Energy Specification

10/21/2021 | 08:00am EST

Renesas Electronics Corporation announced that it is developing new microcontrollers (MCUs) that will support the recently released Bluetooth? 5.3 Low Energy (LE) Specification. The new devices will be part of the Renesas Advanced (RA) Family of 32-bit Arm? Cortex?-M microcontrollers, joining the RA4W1 Bluetooth 5.0 LE device introduced last year. Renesas expects to have first samples of the new MCUs in the first quarter of 2022. The new Bluetooth 5.3 specification was released on July 13, 2021. It includes important new features, such as allowing receivers to filter out messages without involving the host stack to improve the receiver duty cycle. It also enables peripheral devices to provide preferred channels to a central device in order to improve throughput and reliability. In addition, it adds subrated connections that improve switching time between low and high duty cycle connections for applications that occasionally need to switch to burst traffic. On top of these features the direction-finding functionality introduced in Bluetooth 5.1 as well as the isochronous channels added in Bluetooth 5.2 for stereo audio transmission will be supported in Renesas? new MCUs. The inclusion of software-defined radio (SDR) capabilities will allow customers to later migrate to new specification releases. Renesas has a long history of Bluetooth development and deep expertise in the design of Bluetooth LE devices. The new products will be supported by the RA family?s Flexible Software Package (FSP) for easy development of applications and the Renesas QE for Bluetooth LE plug-in, a dedicated Bluetooth profile and application development support tool. The RA family?s high level of security and safety mechanisms, including TrustZone support, is also part of these new products. Renesas is preparing to offer multiple Winning Combinations featuring the new Bluetooth 5.3 LE MCUs along with complementary analog, power and timing devices. Winning Combinations provide an easy to use architecture, simplifying the design process and significantly reducing design risk for customers in a wide variety of applications.


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Financials
Sales 2021 953 B 8 376 M 8 376 M
Net income 2021 126 B 1 103 M 1 103 M
Net Debt 2021 635 B 5 580 M 5 580 M
P/E ratio 2021 22,6x
Yield 2021 -
Capitalization 2 908 B 25 545 M 25 559 M
EV / Sales 2021 3,72x
EV / Sales 2022 2,92x
Nbr of Employees 20 814
Free-Float 61,8%
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Mean consensus BUY
Number of Analysts 14
Last Close Price 1 498,00 JPY
Average target price 2 031,43 JPY
Spread / Average Target 35,6%
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Managers and Directors
Hidetoshi Shibata Chairman, President & Chief Executive Officer
Shuhei Shinkai Chief Finance Officer & Executive Officer
Shinichi Yoshioka Chief Technology Officer & Executive Officer
Tetsuro Toyoda Independent Non-Executive Outside Director
Jiro Iwasaki Independent Non-Executive Outside Director
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