In a context of decarbonization of air transport,
These materials, capable of satisfying difficult operating conditions (temperature constraints, vibrations,...) with a high level of operational performance and reliability, are equipped with high-density electronic boards of components whose manufacture combines the processes of microelectronic assembly and assembly of CMS components. It is in this context that
Within the 'Methods & Innovation' department, your missions
focus more particularly on: * The introduction, qualification and monitoring of microelectronic assembly and control processes: you are the guarantor of the robustness and efficiency of the processes installed; you deploy a continuous improvement approach with SQDC objectives (Safety-Quality-Deadlines-Costs); you lead a benchmark approach to production technologies and equipment; you contribute to the development of the
annual investment plan * The implementation of methods and rules for the design/validation of tools and microelectronic assembly and control programs: you ensure the updating of the Processes standard by declining the requirements in your perimeter: technical specifications, international standards MIL-STD-883, ECSS standards ...
Support for manufacturing teams (resolution of technical facts, training of operational staff, collaboration with maintenance teams): in the event of product and/or process failures, you trigger and manage the corrective actions that are your responsibility; bring you your expertise to support productions, solve problems and train operational staff; you work with suppliers as a business specialist and as such you are required to carry out audits and evaluations.
The industrialization of new products: you are one of the key players in the development of new miniaturized electronic
products and you bring your support and expertise to the R&D and Industrialization teams * The introduction of new technologies: with
Complementary Description
Familiar with microelectronic assembly and control processes (chip report, flip-chip, CMS-Assembly by gluing, sintering-Micro-wiring Wedge-Wedge fine wire, coarse wire, ribbon-Pull&Shear tests) and packaging (Encapsulation Glop top and Dam&Fill-Overmolding by Resin transfer --- 'Chip-on-board' design and hybrid micro-circuit) you contribute to the rise in maturity of the micro-wiring activity of the
Job Requirements
With a general or specialized engineer background (Materials Physics, Semiconductor, Microelectronics,..) you have a successful experience acquired in an industrial environment.
Strength of proposals, you have skills in project management, working group animation, realization of experience plan and you master continuous improvement tools such as Lean Sigma or equivalent.
Contact:
Tel: (33) 1 40 60 80 80
Fax: (33) 1 40 60 81 02
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