Certain Common Stock of Shikino High-Tech Co., Ltd. are subject to a Lock-Up Agreement Ending on 19-SEP-2021.
September 18, 2021
Certain Common Stock of Shikino High-Tech Co., Ltd. are subject to a Lock-Up Agreement Ending on 19-SEP-2021. These Common Stock will be under lockup for 179 days starting from 24-MAR-2021 to 19-SEP-2021.
In connection with this offer and the sale of underwriters through purchase transactions, the sellers Shikino Electroplating Corporation and Mikio Tanaya, the lender Takashi Tsukada, and the shareholders of the Company, Shikino Hi-Tech Employee Stock Ownership Association, Mitsuhiro Hamada, Akihito Miyamoto , Fumio Hirota, Kazuhiko Kishi, Masao Teramoto, Takuya Furukawa, Yukio Miyamoto, Kazunari Nishihara, Nagoya Small and Medium Enterprise Investment Development Co., Ltd., Nagoya Small and Medium Business Investment & Consultation Co., Ltd., Kazuko Miyamoto, Takako Miyamoto, Toyama Daiichi Bank, Ltd. Shuji Tsukada, Shuji Kaneko, Kenji Fukuda, Kohei Sudo, Shigeru Fukai, Kazuki Iguchi, Shinichi Mitarai and Nobuyoshi Muraoka, Issei Iwasaki, Toru Urasaki, Naoki Daimon, Osamu Ueda, Katsuyuki Nakatsubo, Tsuruta Atsunori, Yasuhiro Tanaka, and Noboru Kameda have stated to the lead managing underwriter for the period from the date of conclusion of the original underwriting contract to September 19, 2021, which is the 180th day after the listing date without the prior written consent of the lead managing underwriter, the Company's shares will be sold.
Shikino High Tech Co Ltd is mainly engaged in the development, design, sale and service activities related to semiconductors business. The Company operates in three business segments. The electronic system business produces semiconductor inspection equipment. The main products and technologies include burn-in equipment, semiconductor component inspection boards, semiconductor test programs, dedicated measuring instruments, and electronic devices. The microelectronics business designs large-scale integrated circuits (LSIs) and develops intellectual property (IP) cores. It is also engaged in the design of power supply semiconductor integrated circuit (IC), high-speed I/F circuit, image sensor circuit, image processing LSI, field programmable gate array (FPGA), application specific integrated circuit (ASIC) and others. The product development business manufactures and develops image-related equipment, complementary metal oxide semiconductor (CMOS) camera modules, and others.