Shikino High-Tech CO.,LTD.

6614

JP3348850003

Semiconductor Equipment & Testing

Delayed Japan Exchange Other stock markets 02:00:00 2023-09-29 am EDT			5-day change	1st Jan Change
2526.00 ^JPY	+2.64%		-1.41%	-7.68%

May. 23	Tranche Update on Shikino High-Tech CO.,LTD.'s Equity Buyback Plan announced on May 22, 2023.	CI
May. 23	Shikino High-Tech CO.,LTD.'s Equity Buyback announced on May 22, 2023, has closed with 10,000 shares, representing 0.23% for ¥32.95 million.	CI

Shikino High-Tech Co., Ltd. has filed an IPO.

February 18, 2021 at 12:00 am EST

Shikino High-Tech Co., Ltd. has filed an IPO. Security Name: Common Stock Security Type: Common Stock Securities Offered: 1,230,000 Transaction Features: Sponsor Backed Offering

Latest news about Shikino High-Tech CO.,LTD.

Tranche Update on Shikino High-Tech CO.,LTD.'s Equity Buyback Plan announced on May 22, 2023.	May. 22	CI
Shikino High-Tech CO.,LTD.'s Equity Buyback announced on May 22, 2023, has closed with 10,000 shares, representing 0.23% for ¥32.95 million.	May. 22	CI
Shikino High-Tech CO.,LTD. announces an Equity Buyback for 10,000 shares, for ¥50 million.	May. 22	CI
Shikino High-Tech CO.,LTD. authorizes a Buyback Plan.	May. 21	CI
Shikino High-Tech CO.,LTD. acquired an unknown stake in Magik Eye Inc.	2022	CI
Certain Common Stock of Shikino High-Tech Co., Ltd. are subject to a Lock-Up Agreement Ending on 19-SEP-2021.	2021	CI
Shikino High-Tech Co., Ltd. has completed an IPO in the amount of ¥479.7 million.	2021	CI
Shikino High-Tech Co., Ltd. has filed an IPO.	2021	CI

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Shikino High Tech Co Ltd is mainly engaged in the development, design, sale and service activities related to semiconductors business. The Company operates in three business segments. The electronic system business produces semiconductor inspection equipment. The main products and technologies include burn-in equipment, semiconductor component inspection boards, semiconductor test programs, dedicated measuring instruments, and electronic devices. The microelectronics business designs large-scale integrated circuits (LSIs) and develops intellectual property (IP) cores. It is also engaged in the design of power supply semiconductor integrated circuit (IC), high-speed I/F circuit, image sensor circuit, image processing LSI, field programmable gate array (FPGA), application specific integrated circuit (ASIC) and others. The product development business manufactures and develops image-related equipment, complementary metal oxide semiconductor (CMOS) camera modules, and others.

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Semiconductor Equipment & Testing

Calendar

2023-11-09 - Q2 2023 Earnings Release (Projected)

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Sector Other Semiconductor Equipment & Testing

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