Log in
Log in
Or log in with
Twitter Twitter
Facebook Facebook
Apple Apple     
Sign up
Or log in with
Twitter Twitter
Facebook Facebook
Apple Apple     
  1. Homepage
  2. Equities
  3. France
  4. Euronext Paris
  5. STMicroelectronics N.V.
  6. News
  7. Summary
    STM   NL0000226223


Real-time Euronext Paris  -  09:22 2022-11-28 am EST
36.37 EUR   -2.22%
09:01aSTMicroelectronics achieves EMVCo certification for biometric-payment platform, cutting time-to-market for card issuers
11/25Hopes for Black Friday Boost to Economy Nudge European Equities Higher
11/25STMICRO : Jefferies reiterates its Sell rating
SummaryMost relevantAll NewsAnalyst Reco.Other languagesPress ReleasesOfficial PublicationsSector newsMarketScreener Strategies

CAES Wins Contracts for Development of Next-Generation, Octa-Core, User-Selectable CPU for Space

09/23/2022 | 08:47am EST

PARIS - CAES, a leader in advanced mission-critical electronics for aerospace and defence, announced that it has won multiple contracts with the European Space Agency (ESA) for the development of the GR765 System-on-Chip (SOC), the first user selectable CPU for space.

This next-generation, radiation-hardened device will allow users to select between the LEON5 SPARC V8 or NOEL-V RISC-V RV64 processor cores.

CAES previously received funding from the Swedish National Space Agency (SNSA) within ESA's General Support Technology Program (GSTP) for the preliminary GR765 system requirement development. In parallel, a demo chip with LEON5 and NOEL-V fault tolerant cores has been fabricated on STMicroelectronics' 28nm FDSOI technology. The new incremental Advanced Research in Telecommunications Systems (ARTES) and Technology Development Element (TDE) program contracts will enable CAES to move forward with the GR765 prototype development and manufacturing on this technology.

The official contract signing took place at the International Astronautical Congress (IAC) in the Swedish pavilion, September 22, 2022, in Paris, France. The Director of Telecommunications and Integrated Applications at ESA, Elodie Viau and CAES Gaisler Product's General Manager, Sandi Habinc were in attendance.

'ESA is proud to collaborate with CAES in developing this next generation of data processing technology which is instrumental to build intelligent, powerful and secure systems in space. Our cooperation will enhance Europe's capacity to launch and conduct its ambitious future missions and puts us in a pole position to advance the global technological standard for data processing in space,' said Elodie Viau, Director of Telecommunications and Integrated Applications at ESA.

'The CAES GR765 responds to the ever-increasing demands of telecommunication payload data processing, but also benefits a broad range of other mission-critical applications such as on-board computing,' said Michael Harverson, Head of the Space Segment Section at ESA.

'CAES is excited to announce the first user-selectable CPU for space. We are providing our customers with options to select the best architecture based on their requirements, while meeting the space industry's future needs for more computing and a seamless ecosystem as well as addressing Size, Weight and Power (SWaP),' said Mike Elias, Senior Vice President and General Manager, Space Systems Division, CAES.

CAES will work closely with STMicroelectronics, a leading European semiconductor company, on product manufacturing and qualifications for the GR765. 'We are proud to team with CAES on their next-generation microprocessors for space. The combination of proven SPARC and RISC-V technology with 28nm FDSOI's technology capability and maturity for space is a perfect match,' said Francois Martin, Head of Space & Defense ASICs Business Development, Microcontroller & Digital Group, STMicroelectronics. 'In addition to silicon manufacturing, ST provides HiRel product manufacturing and qualification through its trusted supply chain in its factories in Crolles and Rennes, France.'

The GR765 System-On-Chip will offer greater flexibility and functionality while providing the higher processing and bandwidth needed for future space applications. It will also allow the user to reuse legacy LEON SPARC software or develop new software for the NOEL-V RISC-V architecture, providing the option to leverage state-of-the-art software developed in other industries.

Based on the radiation test on the demo chip, CAES estimates the SEU tolerance for the GR765 product to be at least five times harder than the current radiation hardened processors. CAES will implement its legacy approach to fault tolerance, allowing software to transparently continue execution in presence of correctable errors, as well as extending fault tolerance to peripherals and software libraries.

About CAES

CAES is a pioneer of advanced electronics for the most technologically challenging military and aerospace trusted systems. As the largest provider of mixed-signal and radiation-hardened technology to the United States aerospace and defence industry, CAES delivers high-reliability RF, microwave and millimeter-wave, microelectronic and digital solutions that enable our customers to ensure a safer, more secure planet. On land, at sea, in the air, in space and in cyberspace, CAES' extensive electronics and enhanced manufacturing capabilities are at the forefront of mission-critical military and aerospace innovation.

About ESA'S ARTES Core Competitiveness Programme

ESA's ARTES (Advanced Research in Telecommunications Systems) program is unique in Europe and aims to support the competitiveness of European and Canadian industry on the world market. Core Competitiveness is dedicated to the development, qualification and demonstration of products ('Competitiveness and Growth'), or long-term technology development ('Advanced Technology'). Products in this context can be equipment for the platform or payload of a satellite, a user terminal, or a full telecom system integrating a network with its space segment.


Alaina Monismith

Email: alaina.monismith@caes.com

(C) 2022 Electronic News Publishing, source ENP Newswire

09:01aSTMicroelectronics achieves EMVCo certification for biometric-payment platform, cutting..
11/25Hopes for Black Friday Boost to Economy Nudge European Equities Higher
11/25STMICRO : Jefferies reiterates its Sell rating
11/24Stmicroelectronics N : launches a new advanced 6-axis IMU with embedded sensor fusion and ..
11/23STMICRO : Sell rating from Jefferies
11/22European Midday Briefing: Oil, Mining Stocks Lead European Gain..
11/21STMicroelectronics Announces Status of Common Share Repurchase Program
11/21STMicroelectronics Announces Status of Common Share Repurchase Program
11/14Electronica 2022 Teaser : Industrial AI, What will emerging innovations reveal about us?
11/14STMicroelectronics Announces Status of Common Share Repurchase Program
More news
Analyst Recommendations on STMICROELECTRONICS N.V.
More recommendations
Financials (USD)
Sales 2022 15 970 M - -
Net income 2022 3 699 M - -
Net cash 2022 1 692 M - -
P/E ratio 2022 9,82x
Yield 2022 0,62%
Capitalization 35 179 M 35 179 M -
EV / Sales 2022 2,10x
EV / Sales 2023 1,98x
Nbr of Employees 48 254
Free-Float 72,1%
Duration : Period :
STMicroelectronics N.V. Technical Analysis Chart | MarketScreener
Full-screen chart
Technical analysis trends STMICROELECTRONICS N.V.
Short TermMid-TermLong Term
Income Statement Evolution
Mean consensus OUTPERFORM
Number of Analysts 22
Last Close Price 38,67 $
Average target price 48,33 $
Spread / Average Target 25,0%
EPS Revisions
Managers and Directors
Jean-Marc Chery President & Chief Executive Officer
Lorenzo Grandi President-Finance, Purchasing, ERM & Resilience
Maurizio Tamagnini Chairman-Supervisory Board
Orio Bellezza President-Technology, Manufacturing & Quality
Philippe Dereeper Executive Secretary & Chief Compliance Officer
Sector and Competitors
1st jan.Capi. (M$)
BROADCOM INC.-20.36%214 618
QUALCOMM, INC.-32.49%138 387