Stock 3372 TAIWAN IC PACKAGING CORPORATION
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Company Taiwan IC Packaging Corporation

Equities

3372

TW0003372009

Semiconductors

End-of-day quote Taipei Exchange
Other stock markets
 06:00:00 2024-04-18 pm EDT 		5-day change 1st Jan Change
18 TWD -4.51% Intraday chart for Taiwan IC Packaging Corporation -13.25% +24.14%
Mar. 06 Taiwan IC Packaging Corporation Reports Earnings Results for the Full Year Ended December 31, 2023 CI
Feb. 01 Taiwan Ic Packaging Corporation Announces Resignation of Cheng Yen-Wei as Independent Director CI

Business Summary

Taiwan IC Packaging Corporation is principally engaged in the packaging of integrated circuits (ICs). The Company operates its businesses through packaging of lead frame IC products, including thin small-outline packages (TSOPs), small-outline packages (SOPs) and quad flat packages (QFPs), as well as the packaging of advanced IC products, including thin IC packages and other products. Its products are applied in the manufacture of consumer electronics, computer peripheral products, power management products, drive components, mobile phones, wireless communication products, IC tags and memory cards for portable electronic products. The Company distributes its products primarily in Taiwan, America and Asia.

Number of employees: 392

Sales per Business

TWD in Million2022Weight2023Weight Delta
Advanced Substrate or Leadframe Integrated Circuit Packaging
67.9 %
669 54.7 % 585 67.9 % -12.57%
Traditional Leadframe Integrated Circuit
29.8 %
536 43.8 % 257 29.8 % -52.08%
Other
2.3 %
18 1.5 % 20 2.3 % +9.83%

Sales per region

TWD in Million2022Weight2023Weight Delta
Taiwan
74.8 %
747 61.1 % 645 74.8 % -13.70%
South Korea
13.6 %
301 24.6 % 118 13.6 % -60.92%
Americas
7.1 %
122 10.0 % 61 7.1 % -49.63%
Other
4.4 %
53 4.4 % 38 4.4 % -28.83%

Managers

Managers TitleAgeSince
Chung Ho Tseng CEO
 Chief Executive Officer - 04-09-30
Ching Mei Kuo DFI
 Director of Finance/CFO - -

Members of the board

Members of the board TitleAgeSince
Chung Wan Shu CHM
 Chairman - 08-05-05
Hsien Ming Lin BRD
 Director/Board Member 72 04-06-21
Hsi Che Teng BRD
 Director/Board Member - 01-06-21
Chung Ho Tseng CEO
 Chief Executive Officer - 04-09-30
Chia Hsiang Chang BRD
 Director/Board Member 71 13-06-16
I Wen Chen BRD
 Director/Board Member - 13-06-16
Lung Te Kuo BRD
 Director/Board Member - 16-08-09

Share class

VoteQuantityFree-FloatCompany-owned sharesTotal Float
Stock A 1 175,340,000 103,307,000 ( 58.92 %) 0 58.92 %

Shareholders

NameEquities%Valuation
Dimensional Fund Advisors Ltd.
0.0194 %
34,063 0.0194 % 19 584 NT$
DFA Australia Ltd.
0.001337 %
2,344 0.001337 % 1 348 NT$

Company contact information

Taiwan IC Packaging Corp.

No. 1 South 2nd Road Kaohsiung Export Processing Zone

806, Kaohsiung City

+

http://www.ticp.com.tw
address Taiwan IC Packaging Corporation(3372)

Sector

Technology
Technology Equipment
Semiconductors & Semiconductor Equipment
Semiconductors
Integrated Circuits

Sales per Business

Sales per region

Sector Integrated Circuits

1st Jan change Capi.
TAIWAN IC PACKAGING CORPORATION Stock Taiwan IC Packaging Corporation
+24.14% 102M
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Integrated Circuits
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