Announcement of the major terms of the 2nd issue
of unsecured corporate bond of TSMC in 2022 (111-2)
Date of events
2022/03/18
To which item it meets
paragraph 11
Statement
1.Date of the board of directors resolution:NA
2.Name [issue no.__ of (secured, unsecured) corporate bonds of
___________ (company)]:
2nd issue of unsecured corporate bond of Taiwan Semiconductor
Manufacturing Company, Ltd. in 2022 (111-2)
3.Whether to adopt shelf registration (Yes/No):No
4.Total amount issued:
Total amount NT$14.2 billion; comprised of NT$3.0 billion Tranche A,
NT$9.6 billion Tranche B and NT$1.6 billion Tranche C
5.Face value per bond:NT$10 million
6.Issue price:At par
7.Issuance period:Tranche A: 4 years and 6 months; Tranche B: 5 years;
Tranche C: 7 years
8.Coupon rate:Tranche A: 0.84% p.a.; Tranche B: 0.85% p.a.;
Tranche C: 0.90% p.a.
9.Types, names, monetary values and stipulations of collaterals:None
10.Use of the funds raised by the offering and utilization plan:
Purchase/expansion of facilities and equipment
11.Underwriting method:Public offering through underwriters
12.Trustees of the corporate bonds:Taipei Fubon Commercial Bank Co., Ltd.
13.Underwriter or agent:
Capital Securities Corporation as the lead underwriter
14.Guarantor(s) for the issuance:None
15.Agent for payment of the principal and interest:
Taipei Fubon Commercial Bank Co., Ltd., Shifu Branch
16.Certifying institution:None
17.Where convertible into shares, the rules for conversion:NA
18.Sell-back conditions:None
19.Buyback conditions:None
20.Reference date for any additional share exchange, stock swap, or
subscription:NA
21.Possible dilution of equity in case of any additional share exchange,
stock swap, or subscription:NA
22.Any other matters that need to be specified:
Announcement of the major terms of the 2nd issue of unsecured corporate
bond in 2022 subsequent to 2022/02/15 TSMC Board of Directors' approval
of the issuance of unsecured corporate bond.
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Disclaimer
TSMC - Taiwan Semiconductor Manufacturing Company Ltd. published this content on 18 March 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 18 March 2022 10:00:01 UTC.
Taiwan Semiconductor Manufacturing Co Ltd is a Taiwan-based company mainly engaged in the provision of integrated circuit manufacturing services. The integrated circuit manufacturing services include process technology, special process technology, design ecosystem support, mask technology, 3DFabricTM advanced packaging and silicon stacking technology services. The Company has completed the transfer and mass production of 5nm technology, and is engaged in the research and development of 3nm process technology and 2nm process technology. The product application range covers the entire electronic application industry, including personal computers and peripheral products, information application products, wired and wireless communication system products, servers and data centers.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED 
