Taiwan Semiconductor Manufacturing : TSMC Board of Directors Meeting Resolutions

TSMC Board of Directors Meeting Resolutions

HSINCHU, Taiwan, R.O.C., Aug. 9, 2022 - TSMC (TWSE: 2330, NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:

1. Approved the distribution of a NT$2.75 per share cash dividend for the second quarter of 2022, and set December 21, 2022 as the record date for common stock shareholders entitled to participate in this cash dividend distribution, and the ex-dividend date for the common shares shall be December 15, 2022. As required by Article 165 of Taiwan's Company Law, the shareholders' register shall be closed for five days prior to the record date (December 17 through December 21, 2022) for registration transfer, and the dividend will be paid on January 12, 2023. In addition, the ex-dividend date for TSMC American Depositary Shares (ADSs) will be December 15, 2022. The record date for TSMC ADSs entitled to participate in this cash dividend distribution will be December 16, 2022.
2. Approved capital appropriations of approximately US$9,234.73 million for purposes including:
3. 1. Installation and expansion of advanced technology capacity; 2) Installation of mature and specialty technology capacity.
4. Approved the provision of a guarantee to TSMC Arizona, a wholly-owned subsidiary of TSMC, for its issuance of US dollar-denominated senior unsecured corporate bonds for an amount not to exceed US$4 billion, to finance TSMC's capacity expansion.

About TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world's leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry's leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 291 distinct process technologies, and manufactured 12,302 products for 535 customers in 2021 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the

most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.

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TSMC Spokesperson:	Media Contacts:
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Vice President and CFO	Head of Public Relations	Public Relations
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