TSMC Reports First Quarter EPS of NT$4.51

Hsinchu, Taiwan, R.O.C., April 16, 2020 - TSMC (TWSE: 2330, NYSE: TSM) today announced consolidated revenue of NT$310.60 billion, net income of NT$116.99 billion, and diluted earnings per share of NT$4.51 (US$0.75 per ADR unit) for the first quarter ended March 31, 2020.

Year-over-year, first quarter revenue increased 42.0% while net income and diluted EPS both increased 90.6%. Compared to fourth quarter 2019, first quarter results represented a 2.1% decrease in revenue and a 0.8% increase in net income. All figures were prepared in accordance with TIFRS on a consolidated basis.

In US dollars, first quarter revenue was $10.31 billion, which increased 45.2% year-over-year and decreased 0.8% from the previous quarter.

Gross margin for the quarter was 51.8%, operating margin was 41.4%, and net profit margin was 37.7%.

In the first quarter, shipments of 7-nanometer accounted for 35% of total wafer revenue and 10- nanometer process technology contributed 0.5% while 16-nanometer accounted for 19%. Advanced technologies, defined as 16-nanometer and more advanced technologies, accounted for 55% of total wafer revenue.

TSMC's 2020 first quarter consolidated results:

(Unit: NT$ million, except for EPS)

1Q20

1Q19

YoY

4Q19

QoQ

Amounta

Amount

Inc. (Dec.) %

Amount

Inc. (Dec.) %

Net sales

310,597

218,704

42.0

317,237

2.1

Gross profit

160,777

90,358

77.9

159,202

1.0

Income from operations

128,522

64,266

100

124,244

3.4

Income before tax

132,147

68,182

93.8

128,782

2.6

Net income

116,987

61,394

90.6

116,035

0.8

EPS (NT$)

4.51b

2.37b

90.6

4.47b

0.8

  1. 1Q2020 figures have not been approved by Board of Directors
  2. Based on 25,930 million weighted average outstanding shares

About TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world's largest dedicated semiconductor foundry ever since. The company supports a thriving ecosystem of global customers and partners with the industry's leading process technology and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry.

TSMC serves its customers with global capacity of about 13 million 12-inch equivalent wafers per year in 2020, and provides the broadest range of technologies from 2 micron all the way to foundry's most advanced processes, which is 7-nanometer today. TSMC is the first foundry to provide 7-nanometer production capabilities and the first to commercialize Extreme Ultraviolet (EUV) lithography technology in delivering customer products to market in high volume. TSMC is headquartered in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.

TSMC Spokesperson:

Media Contacts:

Wendell Huang

Nina Kao

Hui-Chung Su

Michael Kramer

Vice President and CFO

Head of PR Department

PR Department

PR Department

Tel: 886-3-505-5901

Tel: 886-3-5636688 ext.7125036

Tel: 886-3-563-6688

Tel: 886-3-563-6688

Mobile: 886-988-239-163

Ext. 7125033

Ext. 7125031

E-Mail: nina_kao@tsmc.com

Mobile: 886-988-930-039

Mobile: 886-988-931-352

E-Mail:hcsuq@tsmc.com

E-Mail: pdkramer@tsmc.com

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TSMC - Taiwan Semiconductor Manufacturing Company Ltd. published this content on 16 April 2020 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 16 April 2020 05:35:02 UTC