Taiwan Semiconductor Manufacturing Company Limited
("TSMC"; NYSE: TSM)
This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors and 5) The unsecured bonds issued by TSMC and its subsidiaries for the month of August 2021.
1. The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
Title
Name
Number of shares held as of
Changes
07/31/2021
08/31/2021
Senior Vice President
Cliff Hou
439,605
440,445
840
Vice President
Connie Ma
215,000
236,000
21,000
Vice President
Marvin Liao
315,485
325,485
10,000
Vice President and
Chief Financial Office
Wendell Huang
1,651,677
1,651,692
15
Vice President
Jun He
7,000
8,000
1,000
Vice President
Geoffrey Yeap
4.000
8,000
4.000
Vice President
Jonathan Lee
330,850
331,522
672
Vice President
L.C. Lu
110,227
120,227
10,000
Note: Shareholdings include shares held by the related parties.
2. The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:Inapplicable
3. The acquisition and disposition of assets by TSMC and its subsidiaries:
(1) Fixed-income investment: NT$5.4 billion of acquisition and NT$5.9 billion of disposition.
4. The capital appropriations approved by TSMC board of directors:
(1) Machinery equipment for advanced technology capacity: NT$228.0 billion;
(2) Machinery equipment for advanced packaging, mature and specialty technology capacity: NT$74.5 billion;
(3) Machinery equipment for R&D capital investments and sustaining capital expenditures: NT$12.8 billion;
(4) Real estate and capitalized leased assets: NT$168.0 billion.
5. The unsecured bonds issued by TSMC and its subsidiaries
Issuance
Tranche
Issuance Period
Total Amount
(in billions)
Coupon
Rate
Repayment
and
Interest Payment
110-4
A
Aug. 2021 ~ Aug. 2025
NT$4.0
0.485%
Bullet repayment; interest payable annually
B
Aug. 2021 ~ Aug. 2026
NT$8.0
0.50%
C
Aug. 2021 ~ Aug. 2028
NT$5.4
0.55%
D
Aug. 2021 ~ Aug. 2031
NT$4.2
0.62%
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TSMC - Taiwan Semiconductor Manufacturing Company Ltd. published this content on 24 September 2021 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 24 September 2021 10:11:05 UTC.
Taiwan Semiconductor Manufacturing Co Ltd is a Taiwan-based company mainly engaged in the provision of integrated circuit manufacturing services. The integrated circuit manufacturing services include process technology, special process technology, design ecosystem support, mask technology, 3DFabricTM advanced packaging and silicon stacking technology services. The Company has completed the transfer and mass production of 5nm technology, and is engaged in the research and development of 3nm process technology and 2nm process technology. The product application range covers the entire electronic application industry, including personal computers and peripheral products, information application products, wired and wireless communication system products, servers and data centers.
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED 
