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​Telekom Research & Development Sdn Bhd (TM R&D), the innovation arm of Telekom Malaysia Berhad (TM), recently bagged two awards at the Malaysia Technology Excellence Awards 2022, organised by the Singapore Business Review.

The Malaysia Technology Excellence Awards spotlights exceptional companies who are technology disruptors that boosts Malaysia's economy. TM's Fast Internet for All (FIRA) solution was bestowed the award under the "Connectivity-Telecommunications" category, while TM's Single Platform on Intelligent Customer Experience (SPICE.ai) won the award in the "Artificial Intelligence (AI)-IT Services" category.

Commenting on these awards, Dr. Sharlene Thiagarajah, Chief Executive Officer, TM R&D said, "I couldn't be prouder of my team as these awards reflect their commitment to meet the fast-evolving digital needs of today's customers and strengthen our position as a research leader in these fields. This recognition also reaffirms our efforts in building smarter digital ecosystems to facilitate the ease with which Malaysians can embrace a more digital lifestyle, while also bringing progress to the nation."

FIRA was introduced as a way to support the government in providing Malaysians with quality access to digital connectivity nationwide. Aimed at offering better internet service to underserved communities, FIRA uses Fixed Wireless Access (FWA) technologies to improve connectivity in rural areas across Malaysia. Since its first deployment in Malacca back in July 2020, the solution has demonstrated promising success in improving download and upload link speeds compared to other broadband services. The solution has since been implemented at a rural school in Selangor and at Pusat Komuniti Desa sites under the Ministry of Rural Development. It has also supported an IR4.0 use case in Terengganu.

"FIRA is formulated to address two common issues: coverage and speed. The solution is capable to deliver connectivity up to 50Mbps within 5-8km range, compared to a traditional 4G cell within 1km range. Furthermore, with its quick deployment procedures, FIRA can help mitigate customers' connectivity concerns in a cost-effective and timely manner," shared Dr. Sharlene.

SPICE.ai, on the other hand, aims to assist frontliners in their daily task of addressing customer service enquiries and requests.

Dr Sharlene explained, "SPICE.ai consists of multiple components that cover different parts of an existing customer experience system. By integrating these components, frontliners gain a more holistic view of each customers' profiles. The solution then implements real-time analytics to improve customer experience, giving frontliners the right information at the right time which allows them to deliver a better experience to customers."

This analytics system has been deployed nationwide for nearly two years and becomes the primary touchpoint for more than 5,000 TM frontliners in most customer interactions across multiple channels. The performance of SPICE.ai has proven to be reliable and seamless even when integrated with more than 20 existing, standalone systems and was still able to relay the processed information through one single platform, on top of providing analytics and advisory.

Established in 2001, TM R&D is the innovation arm of TM Group focusing on creating smarter ecosystems to make business and life easier for a better Malaysia. TM R&D's solutions are clustered around four pillars namely Intelligent Platforms, Data Brokerage, Connectivity/Tools and IR4.0/Digital Solutions. Growing from strength to strength, TM R&D has won multiple global awards and generated more than 2,800 Intellectual Property Rights (IPRs) and 1,400 digital assets to date. TM R&D's innovations are developed in-house and cut across multiple industries such as Utilities, Retail, Agriculture, Healthcare and Education, with safety and productivity as its top priority.

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TM - Telekom Malaysia Berhad published this content on 01 June 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 02 June 2022 01:11:02 UTC.