TIANSHUI HUATIAN TECHNOLOGY CO., LTD. Tianshui Huatian Technology Co., Ltd. Stock
Equities
002185
CNE100000825
Semiconductor Equipment & Testing
|
End-of-day quote
Other stock markets
|
5-day change | 1st Jan Change | ||
| 7.5 CNY | +3.02% |
|
+4.90% | -11.97% |
| Apr. 02 | Tianshui Huatian Technology's 2023 Profit Drops 70% as Revenue Slips 5% | MT |
| Apr. 02 | Tianshui Huatian Technology Co., Ltd. Proposes Final Dividend for the Year 2023 | CI |
| Sales 2024 * | 12.93B 1.79B | Sales 2025 * | 14.96B 2.06B | Capitalization | 24.03B 3.32B |
|---|---|---|---|---|---|
| Net income 2024 * | 282M 38.92M | Net income 2025 * | 857M 118M | EV / Sales 2024 * | 2.27 x |
| Net Debt 2024 * | 5.27B 728M | Net Debt 2025 * | 2.51B 347M | EV / Sales 2025 * | 1.77 x |
| P/E ratio 2024 * |
85
x | P/E ratio 2025 * |
28
x | Employees | 26,427 |
| Yield 2024 * |
0.58% | Yield 2025 * |
0.54% | Free-Float | 71.43% |
More Fundamentals
* Assessed data
More news
| 1 day | +3.02% | ||
| 1 week | +4.90% | ||
| Current month | -5.90% | ||
| 1 month | -9.20% | ||
| 3 months | +6.53% | ||
| 6 months | -12.08% | ||
| Current year | -11.97% |
1 week
7.15
7.65
1 month
7.148.22
Current year
5.659.25
1 year
5.6510.26
3 years
5.6516.25
5 years
4.2620.80
10 years
3.4320.80
| Managers | Title | Age | Since |
|---|---|---|---|
Wei Bing Cui
CEO | Chief Executive Officer | 56 | 09-12-31 |
Yong Song
DFI | Director of Finance/CFO | 61 | 07-02-15 |
Cai Ping Yang
IRC | Investor Relations Contact | - | - |
| Members of the board | Title | Age | Since |
|---|---|---|---|
Hua Bing Luo
CHM | Chairman | 61 | 07-02-15 |
Sheng Li Xiao
CHM | Chairman | 78 | 07-02-15 |
Jian Jun Liu
BRD | Director/Board Member | 55 | 07-02-15 |
| Date | Price | Change | Volume |
|---|---|---|---|
| 24-04-24 | 7.5 | +3.02% | 20,789,560 |
| 24-04-23 | 7.28 | -0.55% | 13,426,250 |
| 24-04-22 | 7.32 | -0.68% | 17,589,830 |
| 24-04-19 | 7.37 | -1.99% | 21,557,190 |
| 24-04-18 | 7.52 | -1.44% | 21,828,480 |
End-of-day quote Shenzhen S.E., April 23, 2024
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Tianshui Huatian Technology Co., Ltd. is a China-based company, principally engaged in packaging and testing of integrated circuit (IC) products. The Company's IC packaging and testing products consist of dual in-line package (DIP) series, small out-line package (SOP) series, shrink small out-line package (SSOP) series, quad flat package (QFP) series and small out-line transistor (SOT) series products, among others. The Company also provides light-emitting diode (LED) products. The Company distributes its products within domestic market and to overseas markets.
Calendar
2024-04-26
- Annual General Meeting
Trading Rating
Investor Rating
ESG Refinitiv
D
Sell
Buy
Mean consensus
OUTPERFORM
Number of Analysts
6
Last Close Price
7.5
CNY
Average target price
9.5
CNY
Spread / Average Target
+26.67%
EPS Revisions
| 1st Jan change | Capi. | |
|---|---|---|
| -11.97% | 3.22B | |
| +12.94% | 87.66B | |
| +13.30% | 25.01B | |
| -6.94% | 19.72B | |
| -7.21% | 15.27B | |
| -14.79% | 3.95B | |
| +13.19% | 3.46B | |
| -25.85% | 2.29B | |
| -0.75% | 1.16B | |
| +7.16% | 1.13B |
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