Tokyo Seimitsu Co., Ltd. Announces Dividend for the Six Months Ended September 30, 2017, Payable on December 7, 2017 and Revises Dividend Guidance for the Year Ending March 31, 2018; Revises Consolidated Earnings Guidance for the Year Ending March 31, 2018
November 14, 2017 at 01:00 am EST
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Tokyo Seimitsu Co., Ltd. announced dividend for the six months and revised dividend guidance for the year ending March 31, 2018. For the six months, the company announced dividend of JPY 41 compared to JPY 36 a year ago. The effective date of distribution is December 7, 2017.
For the year ending March 31, 2018, the company expects to pay dividend of JPY 41.00 per share against previous forecast of JPY 36.00 per share. The company maintains a core policy regarding the distribution of profits linked to the business performance of the company and targets a consolidated dividend payout ratio of 30%. The company ratified a revised forecast of dividend per share for Fiscal year 2018 based on the above revision of consolidated forecasts.
The company revised consolidated earnings guidance for the year ending March 31, 2018. For the year, the company revised net sales of JPY 85,000 million, operating income of JPY 16,000 million, ordinary income of JPY 16,000 million, net Income attributable to owners of the parent of JPY 11,200 million or JPY 270.00 per share compared to previously expected net sales of JPY 79,000 million, operating income of JPY 14,000 million, ordinary income of JPY 14,000 million, net Income attributable to owners of the parent of JPY 10,000 million or JPY 241.20 per share. Reason for revision the SPE business segment results for the first half of 2018 exceeded the previously forecast figures. The company has ratified revisions to the prospective consolidated business forecasts as shown above, in anticipation that these results will flow through to the remainder of the fiscal year.
Tokyo Seimitsu Co Ltd is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing equipment and precision measuring equipment. The Semiconductor Manufacturing Equipment segment is engaged in the manufacture and sale of processing and inspection equipment for the manufacture of semiconductor, such as wafer probing machines and wafer dicing machines, as well as the provision of after-sales services and the development of related software. The Measuring Equipment segment is engaged in the manufacture and sale of precision measuring equipment for three-dimensional (3D) vision systems, as well as surface roundness and profile shape measuring instruments including 3D coordinate measuring machine, true degree and column shape measuring machine, surface roughness measuring machine, wheel shape measuring machine and others.
Tokyo Seimitsu Co., Ltd. Announces Dividend for the Six Months Ended September 30, 2017, Payable on December 7, 2017 and Revises Dividend Guidance for the Year Ending March 31, 2018; Revises Consolidated Earnings Guidance for the Year Ending March 31, 2018