Tokyo Seimitsu : Earnings Conference (with Note) for FY2021/3
May 10, 2021 at 05:14 am EDT
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Speakers:
Hitoshi YOSHIDA, President and CEO
Ryuichi KIMURA, Executive Vice President and COO
Koichi KAWAMURA, Representative Director and CFO
2
While the Company faced COVID-19 pandemic impacts, mainly affecting the Metrology business, SPE business remained firm.
Year-enddividend will be 62JPY per share (please refer to news release today).
Sales amount exceeded previous forecast, and supported OP margin improvement.
Bookings amount recorded historical high.
In 4Q, OP margin was 23% thanks to increase in sales.
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Tokyo Seimitsu Co. Ltd. published this content on 10 May 2021 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 10 May 2021 09:13:07 UTC.
Tokyo Seimitsu Co Ltd is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing equipment and precision measuring equipment. The Semiconductor Manufacturing Equipment segment is engaged in the manufacture and sale of processing and inspection equipment for the manufacture of semiconductor, such as wafer probing machines and wafer dicing machines, as well as the provision of after-sales services and the development of related software. The Measuring Equipment segment is engaged in the manufacture and sale of precision measuring equipment for three-dimensional (3D) vision systems, as well as surface roundness and profile shape measuring instruments including 3D coordinate measuring machine, true degree and column shape measuring machine, surface roughness measuring machine, wheel shape measuring machine and others.