TOSHIBA The new products feature low On-resistance with Toshiba's new process. In addition, the TSOP6F package has expanded the chip mounting capability with its flat leads, reducing their thermal resistance. Accordingly, the products feature a power dissipation rating of 1.5 W, helping reduce the power consumption of equipment. Furthermore, the TSOP6F package has reduced the mounting area by about 70 % compared to the Toshiba's SOP-8 package with a similar power dissipation rating, helping reduce the size of equipment.
As a result of this addition to the lineup, we now offer six N-channel[1] and three P-channel[1] single-type MOSFET products that use the TSOP6F package, allowing users to select from a wider range of products.
Notes :
[1] As of
Applications
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Pin Assignments
The illustration of pin assignments of Lineup Expansion of 1.5 W MOSFET Products that Use The Small TSOP6F Package and Help Reduce The Size of Equipment
Application Circuit Example
The illustration of application circuit example of Lineup Expansion of 1.5 W MOSFET Products that Use The Small TSOP6F Package and Help Reduce The Size of Equipment
Note :
The application circuits shown in this document are provided for reference purposes only.
Thorough evaluation is required, especially at the mass-production design stage.
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