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    6502   JP3592200004

TOSHIBA CORPORATION

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Toshiba : New Technology for SiC Power Modules Improves Reliability and Reduces Size

05/10/2021 | 09:58am EDT

TOKYO - Toshiba Electronic Devices & Storage Corporation ('Toshiba') has developed package technology for silicon carbide (SiC) power modules that doubles their reliability [1] and reduces their footprint by 20%[2].

SiC realizes higher voltages and lower losses than silicon, and is widely seen as the next-generation material for power devices. While use now centers on inverters for trains, wider deployment in high-voltage applications is on the horizon, including in photovoltaic power systems and automotive equipment.

Reliability is the main concern that has limited use of SiC devices. Application in high voltage power modules requires that not only the semiconductor chip but also the package itself delivers high-level reliability. Toshiba has achieved this with a new silver (Ag) sintering technology for die bonding.

With current SiC packages, it is difficult to suppress increased on-resistance in chips over time, as higher power densities and switching frequencies trigger deterioration in their soldering. Ag sintering significantly reduces this deterioration. The thermal resistance in the Ag-sintered layer is also half that of a soldered layer, which allows chips in the module to be positioned closer together, realizing a smaller footprint.

Toshiba has dubbed the new package iXPLV, and will apply it to mass production of 3.3kV class SiC power module from the end of this month. Details of the technology were reported on May 5 at PCIM Europe, an international power semiconductor conference held online.

Contact:

Power Device Sales & Marketing Department

Tel: +81-3-3457-3416

(C) 2021 Electronic News Publishing, source ENP Newswire

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Financials
Sales 2021 3 076 B 27 906 M 27 906 M
Net income 2021 84 063 M 763 M 763 M
Net Debt 2021 70 157 M 636 M 636 M
P/E ratio 2021 25,7x
Yield 2021 1,03%
Capitalization 2 167 B 19 655 M 19 660 M
EV / Sales 2021 0,73x
EV / Sales 2022 0,72x
Nbr of Employees 125 648
Free-Float 93,4%
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Number of Analysts 10
Average target price 4 753,50 JPY
Last Close Price 4 775,00 JPY
Spread / Highest target 14,2%
Spread / Average Target -0,45%
Spread / Lowest Target -17,7%
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Managers and Directors
NameTitle
Masayoshi Hirata Chief Financial Officer & Head-Accounting
Satoshi Tsunakawa President & Chief Executive Officer
Keiichi Yumita Head-Information Systems
Yutaka Sata Vice President-Research & Development
Yoshimitsu Kobayashi Independent Outside Director
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