Taiwanese semiconductor giant TSMC announced on Tuesday the upcoming opening of a chip design center in Munich, Germany, strengthening its presence in Europe amid a strategic relocation of technology value chains.
Paul de Bot, president of TSMC Europe, said at the group's Technology Symposium 2025 that the Munich center would be operational in Q3 2025. "It is intended to support European customers in the design of high-density, high-performance, and low-power chips, with a focus on automotive, industrial, artificial intelligence (AI), and Internet of Things (IoT) applications," he said.
Strengthening the European semiconductor ecosystem
This initiative is part of TSMC's broader strategy to establish a long-term presence on the continent. In partnership with Infineon, NXP, and Bosch, the group is also building a semiconductor manufacturing plant in Dresden, Germany. Called the European Semiconductor Manufacturing Company (ESMC), this joint venture aims to strengthen Europe's technological autonomy and support key industries, including automotive and embedded systems.
In the face of geopolitical tensions and recent shortages, European authorities are encouraging the local development of a chip ecosystem. TSMC, the world leader in semiconductor foundry, is playing a central role in this strategy by making its cutting-edge technologies available to European industrial customers.
The opening of this center in Munich, a major technology hub in Germany, aims to strengthen local collaboration in critical design phases in order to accelerate the development of solutions tailored to the specific needs of the European market.
