Unisem (M)

Unisem (M) Berhad is a Malaysia-based company that is primarily engaged in the manufacturing of semiconductor devices. The Company is also a semiconductor assembly and test services provider. The Company offers an integrated suite of packaging and test services, such as wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits (IC) packaging, wafer level chipscale packaging (CSP) and radio frequency (RF), analog, digital and mixed-signal test services. Its services include design, assembly, test, failure analysis, and electrical and thermal characterization. The Company has factory locations in Ipoh, Malaysia and Chengdu, People’s Republic of China. Its geographical segments include Malaysia and the People’s Republic of China. Its subsidiaries include Unisem Advanced Technologies Sdn. Bhd., Unisem Chengdu Co., Ltd., Unisem (Mauritius) Holdings Limited, Unisem Chengdu International Import & Export Co., Ltd., and Unisem (Ipoh) Sdn. Bhd.