The Omdia paper, Data Center Thermal Management Report 2020, published in late 2020 and based on 2018 and 2019 data, states that Vertiv has a 23.5% share of the global data center cooling market — more than 10% higher than its nearest rival. The market for data center thermal technology is set to increase from
In addition to analysing market position, the report provides insight and intelligence on how data center cooling technology is evolving. Established technologies such as chillers and perimeter cooling will remain a large proportion of the market. According to Omdia, split DX is still the primary form of heat rejection in data center thermal management, but chilled water and direct evaporative heat rejection are gaining momentum. In addition, cloud and colocation service provider momentum has accelerated, driving double-digit growth for air handling units (AHU).
Omdia predicts there will also be strong growth in forms of liquid cooling — immersion and direct-to-chip — that are expected to double between 2020 and 2024. Several factors are contributing to this shift, including increasing chip and server power consumption, edge growth, increasing rack densities, as well as energy efficiency and sustainability requirements.
"Vertiv's enduring leadership in thermal management demonstrates that our customers value our domain expertise, our broad-ranging portfolio and the increasing investment in technology, research and development," said
Vertiv has announced several recent innovations in thermal technology. In EMEA, Vertiv announced Vertiv(TM) Liebert® OFC, a new and highly advanced range of oil-free turbocor compressor chillers developed in partnership with Geoclima (https://bit.ly/3fZtxXh). The Liebert OFC has been designed to utilize low GWP refrigerants including R1234ze and to provide high energy efficiency. Moreover, the entire floor-mount air conditioning range has been recently redesigned for utmost efficiency, including the direct expansion VertivLiebertPDX(https://bit.ly/2JuQx4d) with variable speed compressors and the chilled water range with the newest Vertiv LiebertPCW (https://bit.ly/33yTYy1).
In addition to internal innovations, Vertiv is also working with industry thought leadership groups and recently became a Platinum Member of the
Vertiv’s own research into thermal technologies also points to future innovation. According to Vertiv’s Data Center 2025: Closer to the Edge (https://bit.ly/2VsaZ8K) report, the data center industry has seen a large-scale shift to economization driven by hyperscale operators and colocation providers, while simultaneously driving heat removal closer to servers through rear door and liquid cooling systems designed to support the high-density racks common in high performance computing (HPC) facilities. Of the 800+ data center professionals that responded to the survey, 42% expect future cooling requirements to be met by mechanical systems, while 22% say they will be met with liquid cooling and outside air, a result likely driven by the more extreme rack densities being observed today.
For more information on the latest thermal management technology advances across EMEA, join the
Distributed by
Media Contact:
Lerato Chiyangwa
E: lerato.chiyangwa@apo-opa.com
About Vertiv:
© African Press Organization, source