Hua Hong Semiconductor Limited proposed final dividend for the year ended 31 December 2023 of HKD 0.165 per share. Date of shareholders' approval: 9 May 2024. Ex-dividend date: 3 June 2024.
Record date: 6 June 2024. Payment date: 26 June 2024.
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5-day change | 1st Jan Change | ||
15.72 HKD | +1.68% | +8.26% | -16.74% |
Hua Hong Semiconductor Limited proposed final dividend for the year ended 31 December 2023 of HKD 0.165 per share. Date of shareholders' approval: 9 May 2024. Ex-dividend date: 3 June 2024.
Record date: 6 June 2024. Payment date: 26 June 2024.
1st Jan change | Capi. | |
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-16.74% | 4.28B | |
+75.35% | 2,159B | |
+19.33% | 623B | |
+31.87% | 622B | |
+8.09% | 254B | |
+15.42% | 185B | |
+4.43% | 162B | |
-37.48% | 136B | |
+33.13% | 127B | |
+35.30% | 105B |