TTM Technologies, Inc. Announces Upcoming Conference Participation
May 08, 2024 at 04:07 pm EDT
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SANTA ANA, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ: TTMI), today announced that members of its management team will attend the following investor conferences:
Barclays Leveraged Finance Conference on May 21st at the Omni Barton Creek Hotel in Austin, Texas,
B. Riley Institutional Investor Conference on May 22nd at the Beverly Hilton Hotel, in Beverly Hills, California, with a presentation at 3:15pm Eastern Time, and
Stifel Cross Sector Insight Conference on June 4th at the Intercontinental Hotel in Boston, Massachusetts, with a presentation at 3:00pm Eastern Time.
About TTM TTM Technologies, Inc. is a leading global manufacturer of technology solutions including mission systems, radio frequency (“RF”) components/RF microwave/microelectronic assemblies, quick-turn and technologically advanced printed circuit boards (“PCBs”). TTM stands for time-to-market, representing how TTM's time-critical, one-stop manufacturing services enable customers to shorten the time required to develop new products and bring them to market. Additional information can be found at www.ttm.com.
TTM Technologies, Inc. is a global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and quick-turn and technologically advanced printed circuit boards (PCB). The Company's segments include PCB, and RF and Specialty Components (RF&S Components). The PCB segment consists of approximately 16 domestic system, sub-system, and PCB plants; four PCB fabrication plants in China; one in Malaysia, and one in Canada. The RF&S Components segment consists of one domestic RF component plant and one RF component plant in China. Each segment operates predominantly in the same industries with facilities that produce customized products for its customers and use similar means of product distribution. It offers a range of engineered systems, RF and microwave assemblies, high density interconnect (HDI) PCBs, rigid-flex PCBs, custom assemblies and system integration, integrated circuit (IC) substrates and others.