Valuation: Kinsus Interconnect Technology Corp.

Market Cap 559B 17.48B 15.65B 14.59B 13.23B 24.95B 1,671B 25.11B 175B 68.62B 862B 65.66B 64.2B 2,775B P/E 2026 *
93.4x
P/E 2027 * 42.8x
Enterprise Value 563B 17.6B 15.76B 14.69B 13.32B 25.13B 1,683B 25.29B 177B 69.11B 868B 66.13B 64.66B 2,794B EV / Sales 2026 *
10.6x
EV / Sales 2027 * 7.17x
Free-Float
60.38%
Yield 2026 *
0.53%
Yield 2027 * 1.19%
1 day-1.40%
1 week-3.20%
Current month+9.28%
1 month+28.95%
3 months+33.33%
6 months+178.22%
Current year+566.67%
1 week 1,040
Extreme 1040
1,145
1 month 784
Extreme 784
1,150
Current year 151.5
Extreme 151.5
1,150
1 year 122.5
Extreme 122.5
1,150
3 years 60.8
Extreme 60.8
1,150
5 years 60.8
Extreme 60.8
1,150
10 years 30.3
Extreme 30.3
1,150
Manager TitleAgeSince
Chief Executive Officer - -
Corporate Officer/Principal - 2022-04-30
Director of Finance/CFO - 2000-07-31
Director TitleAgeSince
Director/Board Member 65 2000-08-31
Chairman - 2000-09-10
Director/Board Member - -
Change 5-day change 1-year change 3-year change Capi.($)
-1.40%-3.20%+670.91%+904.74% 17.72B
-1.29%-5.27%+23.56%+382.10% 5,536B
-0.39%-1.36%+76.39%+361.82% 2,069B
-1.88%-2.15%+9.27%+291.71% 1,726B
-3.88%-7.04%+444.63%+1,317.98% 1,164B
-2.28%-5.94%+176.52%+446.23% 993B
-4.52%-12.82%+275.00%+1,192.27% 913B
-3.20%-12.77%+178.66%+175.11% 550B
-5.22%-11.77% - - 517B
-4.15%-15.73%+64.87%+392.27% 284B
Average -1.83%-7.41%+213.31%+607.13% 1,377B
Weighted average by Cap. -1.22%-5.40%+103.91%+502.33%

Financials

2026 *2027 *
Net sales 53.08B 1.66B 1.49B 1.39B 1.26B 2.37B 159B 2.39B 16.66B 6.52B 81.94B 6.24B 6.1B 264B 78.88B 2.47B 2.21B 2.06B 1.87B 3.52B 236B 3.55B 24.76B 9.69B 122B 9.27B 9.07B 392B
Net income 5.9B 185M 165M 154M 140M 264M 17.65B 265M 1.85B 725M 9.11B 693M 678M 29.3B 14.99B 469M 420M 392M 355M 670M 44.85B 674M 4.71B 1.84B 23.15B 1.76B 1.72B 74.48B
Net Debt 3.98B 125M 111M 104M 94.25M 178M 11.9B 179M 1.25B 489M 6.14B 468M 457M 19.77B 7.33B 229M 205M 192M 174M 328M 21.94B 330M 2.3B 901M 11.32B 862M 843M 36.43B
Projected Income Statement - Annual - Kinsus Interconnect Technology Corp.
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
26-10-12 NT$1,060.00 -1.40% 6,619,979
26-10-08 NT$1,075.00 -2.27% 7,260,373
26-10-07 NT$1,100.00 +2.80% 13,227,551
26-10-06 NT$1,070.00 -2.28% 10,026,874
Trader
Investor
Global
Quality
ESG MSCI
B
Ratings Surperformance© - Kinsus Interconnect Technology Corp.
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
13
Last Close Price
1,060.00TWD
Average target price
1,042.15TWD
Spread / Average Target
-1.68%

Quarterly revenue - Rate of surprise

Rate of surprise - Net sales - Quarterly - Kinsus Interconnect Technology Corp.
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