Valuation: Kinsus Interconnect Technology Corp.

Market Cap 436B 13.73B 11.96B 11.26B 10.26B 19.24B 1,316B 19.3B 135B 51.97B 670B 51.58B 50.43B 2,159B P/E 2026 *
78.1x
P/E 2027 * 33.5x
Enterprise Value 440B 13.86B 12.07B 11.36B 10.35B 19.42B 1,328B 19.48B 136B 52.45B 676B 52.05B 50.89B 2,179B EV / Sales 2026 *
8.34x
EV / Sales 2027 * 5.64x
Free-Float
60.38%
Yield 2026 *
0.57%
Yield 2027 * 1.38%
1 day-0.60%
1 week+0.61%
Current month+0.98%
1 month-2.82%
3 months+14.23%
6 months+117.63%
Current year+420.13%
1 week 785
Extreme 785
878
1 month 766
Extreme 766
960
Current year 151.5
Extreme 151.5
960
1 year 105
Extreme 105
960
3 years 60.8
Extreme 60.8
960
5 years 60.8
Extreme 60.8
960
10 years 30.3
Extreme 30.3
960
Manager TitleAgeSince
Chief Executive Officer - -
Corporate Officer/Principal - 2022-04-30
Director of Finance/CFO - 2000-07-31
Director TitleAgeSince
Director/Board Member 65 2000-08-31
Chairman - 2000-09-10
Director/Board Member - -
Change 5-day change 1-year change 3-year change Capi.($)
-0.60%+0.61%+655.25%+648.42% 13.67B
+6.37%+9.27%+247.92%+560.08% 231B
+0.69%+3.88%-5.95%+244.18% 96.3B
+0.10%-8.76%+279.46%+1,104.18% 54.77B
-0.58%+0.31%+149.07%+1,024.03% 53.35B
+3.98%+4.40%+547.62%+455.86% 50.56B
+2.74%-0.42%+101.98%+682.10% 39.08B
+2.02%-1.75%+66.01%+533.80% 35.46B
+1.65%+15.34% - - 33.12B
+9.23%+8.30%-22.02%+1,095.18% 32.36B
Average +2.56%+5.99%+224.37%+705.31% 63.94B
Weighted average by Cap. +3.50%+7.60%+201.47%+628.07%

Financials

2026 *2027 *
Net sales 52.75B 1.66B 1.45B 1.36B 1.24B 2.33B 159B 2.34B 16.33B 6.29B 81.06B 6.24B 6.1B 261B 78.56B 2.48B 2.16B 2.03B 1.85B 3.47B 237B 3.48B 24.32B 9.37B 121B 9.3B 9.09B 389B
Net income 5.4B 170M 148M 139M 127M 238M 16.29B 239M 1.67B 644M 8.29B 639M 625M 26.74B 12.92B 407M 355M 334M 304M 570M 38.99B 572M 4B 1.54B 19.85B 1.53B 1.49B 64B
Net Debt 3.98B 125M 109M 103M 93.66M 176M 12.01B 176M 1.23B 475M 6.11B 471M 460M 19.72B 7.33B 231M 201M 189M 173M 324M 22.14B 325M 2.27B 875M 11.27B 868M 849M 36.34B
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
26-09-21 NT$827.00 -0.60% 23,271,137
26-09-18 NT$832.00 +3.35% 16,702,063
26-09-17 NT$805.00 -1.83% 15,614,754
26-09-16 NT$820.00 +3.14% 10,957,053
26-09-15 NT$795.00 -0.38% 7,509,520
Trader
Investor
Global
Quality
ESG MSCI
B
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
13
Last Close Price
827.00TWD
Average target price
952.77TWD
Spread / Average Target
+15.21%

Quarterly revenue - Rate of surprise

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