Valuation: Kinsus Interconnect Technology Corp.

Market Cap 365B 11.28B 9.85B 9.09B 8.38B 15.8B 1,086B 16.17B 109B 42.7B 531B 42.37B 41.44B 1,832B P/E 2026 *
67.3x
P/E 2027 * 31.2x
Enterprise Value 364B 11.26B 9.83B 9.07B 8.36B 15.76B 1,084B 16.13B 108B 42.61B 530B 42.28B 41.35B 1,828B EV / Sales 2026 *
6.8x
EV / Sales 2027 * 4.67x
Free-Float
60.37%
Yield 2026 *
0.65%
Yield 2027 * 1.51%
1 day-10.00%
1 week-12.83%
Current month-22.22%
1 month+7.94%
3 months+76.11%
6 months+260.00%
Current year+335.85%
1 week 693
Extreme 693
859
1 month 687
Extreme 687
939
Current year 151.5
Extreme 151.5
939
1 year 99.9
Extreme 99.9
939
3 years 60.8
Extreme 60.8
939
5 years 60.8
Extreme 60.8
939
10 years 30.3
Extreme 30.3
939
Manager TitleAgeSince
Chief Executive Officer - -
Director of Finance/CFO - 2000-07-31
Chief Operating Officer - -
Director TitleAgeSince
Chairman 65 2000-08-31
Director/Board Member - 2010-06-17
Chairman - 2000-09-10
Change 5-day change 1-year change 3-year change Capi.($)
-10.00%-12.83%+576.10%+521.52% 12.57B
-8.92%-14.14%+139.01%+386.99% 183B
-9.97%-18.97%+49.12%+235.98% 115B
-10.00%-7.42%+381.15%+898.02% 72.33B
-9.92%-15.11%+357.27%+1,366.56% 55.4B
-12.36%-20.56% - - 52.57B
-9.98%-9.26%+485.98%+324.60% 44.83B
-6.52%-6.92%+161.30%+406.94% 38.84B
-10.86%-18.60%+55.78%+833.51% 38.28B
-8.24%-24.53%+170.38%+443.43% 36.6B
Average -9.68%-10.34%+264.01%+601.95% 64.91B
Weighted average by Cap. -9.62%-10.04%+204.66%+542.42%

Financials

2026 *2027 *
Net sales 53.62B 1.66B 1.45B 1.34B 1.23B 2.32B 159B 2.37B 15.96B 6.27B 78B 6.22B 6.08B 269B 77.09B 2.38B 2.08B 1.92B 1.77B 3.34B 229B 3.41B 22.95B 9.02B 112B 8.95B 8.75B 387B
Net income 5.21B 161M 141M 130M 120M 226M 15.51B 231M 1.55B 610M 7.59B 605M 592M 26.16B 10.62B 328M 287M 264M 244M 460M 31.59B 470M 3.16B 1.24B 15.45B 1.23B 1.21B 53.28B
Net Debt -772M -23.87M -20.84M -19.24M -17.72M -33.42M -2.3B -34.21M -230M -90.33M -1.12B -89.63M -87.66M -3.88B -5.43B -168M -147M -135M -125M -235M -16.16B -241M -1.62B -635M -7.9B -630M -616M -27.25B
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
26-07-17 NT$693.00 -10.00% 3,693,770
26-07-16 NT$770.00 -8.88% 2,674,083
26-07-15 NT$845.00 +4.97% 4,103,308
26-07-14 NT$805.00 -1.71% 3,717,468
26-07-13 NT$819.00 +3.02% 3,480,697
Trader
Investor
Global
Quality
ESG MSCI
B
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
12
Last Close Price
693.00TWD
Average target price
868.00TWD
Spread / Average Target
+25.25%

Quarterly revenue - Rate of surprise

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