Micro Silicon Electronics Co., Ltd. Stock price
Equities
8162
TW0008162009
Semiconductor Equipment & Testing
End-of-day quote
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5-day change | 1st Jan Change | |
44.45 TWD | -0.78% | +8.41% | +34.09% |
Sales 2022 | 1,227 M 39.21 M | Sales 2023 * | - | Capitalization | 2,143 M 68.52 M |
---|---|---|---|---|---|
Net income 2022 | 168 M 5.37 M | Net income 2023 * | - | EV / Sales 2022 | 1,90x |
Net Debt 2022 | 190 M 6.07 M | Net cash position 2023 * | - 0 | EV / Sales 2023 * | - |
P/E ratio 2022 | 12,4x | P/E ratio 2023 * | Employees | 555 | |
Yield 2022 | 4,52% | Yield 2023 * |
-
| Free-Float | 68.63% |
More Fundamentals
* Assessed data
More news
1 day | -0.78% | ||
1 week | +8.41% | ||
Current month | -0.78% | ||
1 month | +9.89% | ||
3 months | +16.82% | ||
6 months | +16.67% | ||
Current year | +34.09% |
1 week
40.35
45.30

1 month
40.30
45.30

Current year
32.85
45.30

1 year
30.60
45.30

3 years
27.20
59.00

5 years
27.20
59.00

10 years
27.20
59.00

Managers | Title | Age | Since |
---|---|---|---|
Ping Tang Chang
CEO | Chief Executive Officer | - | 1986 |
Yueh Yun Lue
DFI | Director of Finance/CFO | - | 1992 |
Chen Chang
CTO | Chief Tech/Sci/R&D Officer | - | 2016 |
Members of the board | Title | Age | Since |
---|---|---|---|
Wan Shou Wen
BRD | Director/Board Member | - | 2022 |
Wei Cheng Chang
BRD | Director/Board Member | - | 2022 |
Chun Hao Peng
BRD | Director/Board Member | - | 2022 |
Date | Price | Change | Volume |
---|---|---|---|
23-12-01 | 44.45 | -0.78% | 113,316 |
23-11-30 | 44.80 | +9.67% | 204,865 |
23-11-29 | 40.85 | +1.24% | 46,103 |
23-11-28 | 40.35 | -1.59% | 72,106 |
23-11-27 | 41.00 | 0.00% | 14,052 |
End-of-day quote Taipei Exchange, December 30, 2023
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Micro Silicon Electronics Co Ltd is a Taiwan-based semiconductor testing service provider. The Company provides integrated circuit (IC) testing services, including analog ICs, logic ICs, driver ICs, metal oxide semiconductor field effect transistors (MOSFETs), insulated gate bipolar transistors (IGBTs), gallium nitride (GaN) and silicon carbide (SiC) and other wafer testing services. Its services include wafer coating and thinning services, die dicing, picking and packaging services. The Company also provides services such as probe card manufacturing, wafer lapping, wafer metal coating, and wafer dicing. The Company's products are mainly sold in Taiwan, America, other parts of Asia and Europe.
1st Jan change | Capi. | |
---|---|---|
+34.09% | 91 M $ | |
+26.54% | 273 B $ | |
+71.80% | 95 164 M $ | |
+84.03% | 74 976 M $ | |
+36.32% | 17 551 M $ | |
+65.12% | 16 262 M $ | |
-32.72% | 7 827 M $ | |
+18.68% | 6 995 M $ | |
+107.15% | 6 923 M $ | |
+157.09% | 7 006 M $ |