Valuation: Strasbaugh

Market Cap 10M 8.57M 8.01M 7.34M 13.77M 957M 13.95M 94.69M 36.93M 481M 37.55M 36.73M 1.59B P/E 2008
-2.77x
P/E 2009 -1.14x
Enterprise Value 8.76M 7.5M 7.02M 6.43M 12.06M 838M 12.22M 82.95M 32.35M 421M 32.89M 32.18M 1.39B EV / Sales 2008
1.77x
EV / Sales 2009 0.29x
Free-Float
100%
Yield 2008 *
-
Yield 2009 -
1 week+909,900.00%
Current month+909,900.00%
1 month+909,900.00%
3 months+909,900.00%
6 months+909,900.00%
Current year+909,900.00%
5 years 0
Extreme 1.0E-6
0.01
10 years 0
Extreme 1.0E-6
0.51
Manager TitleAgeSince
Chief Executive Officer 76 2007-04-30
Director TitleAgeSince
Chairman 76 2007-04-30
Change 5-day change 1-year change 3-year change Capi.($)
-.--%+909,900.00%+909,900.00%+909,900.00% 14
-0.78%-2.93%+208.01%+230.93% 391B
+0.26%-3.28%+97.91%+277.24% 77.12B
-0.82%-3.29%+166.85%+299.65% 51.65B
+0.70%-7.09%+105.95%+91.20% 47.48B
+1.72%-6.28%+58.92%+136.00% 41.87B
+0.33%-2.14%+288.81%+367.01% 29B
+1.52%-11.96%+47.39%-12.59% 26.37B
+2.07%-1.41%+154.07%+185.94% 21.6B
+0.95%-8.87%+84.32%+102.96% 20.08B
Average +0.61%-6.64%+91,111.22%+91,157.83% 70.59B
Weighted average by Cap. -0.08%-7.16%+169.41%+217.46%

Financials

2008 2009
Net sales 9.55M 8.18M 7.66M 7.01M 13.15M 914M 13.33M 90.47M 35.28M 459M 35.87M 35.09M 1.52B 12.87M 11.03M 10.32M 9.44M 17.72M 1.23B 17.96M 122M 47.54M 619M 48.34M 47.29M 2.05B
Net income -4.51M -3.86M -3.61M -3.31M -6.21M -431M -6.29M -42.69M -16.65M -217M -16.93M -16.56M -717M -680K -582K -545K -499K -936K -65.06M -949K -6.44M -2.51M -32.68M -2.55M -2.5M -108M
Net Debt -0.19 -0.16 -0.15 -0.14 -0.26 -17.99 -0.26 -1.78 -0.69 -9.04 -0.71 -0.69 -29.89 -1.24 -1.06 -0.99 -0.91 -1.71 -118.64 -1.73 -11.74 -4.58 -59.6 -4.66 -4.55 -197.13
Logo Strasbaugh
Strasbaugh design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, micro-electromechanical system (MEMS), ), light emitting diode (LED), Telecommunications and Precision Optics industries. The products are used by the customers in the fabrication of integrated circuits, known as chips or semiconductors, and in the fabrication of silicon wafers. The semiconductors are built on a silicon wafer base and include a range of circuit components, which are connected by multiple layers of wiring or interconnect. The Company’s products are STB P300- 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system; 6EG -300mm CMP System: 1 spindle, 1 table CMP system; 6EC- 200mm CMP System: 1 spindle, 1 table CMP system; 6DS-SP - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system; 7AF, 7AF-SP & 7AA-II - 200mm & 150mm Wafer Grinders, and 6DZ - 200mm Prime Wafer Polisher.
Employees
82
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