Valuation: Tongfu Microelectronics Co.,Ltd

Capitalization 46.29B 6.33B 6.12B 5.79B 5.1B 9.06B 550B 10.11B 69.12B 25.51B 229B 23.74B 23.26B 980B P/E ratio 2024 *
55.1x
P/E ratio 2025 * 35.4x
Enterprise value 53.54B 7.32B 7.07B 6.7B 5.9B 10.48B 637B 11.69B 79.94B 29.51B 265B 27.46B 26.91B 1,134B EV / Sales 2024 *
2.25x
EV / Sales 2025 * 1.75x
Free-Float
64.13%
Yield 2024 *
0.11%
Yield 2025 * 0.37%
More valuation ratios * Estimated data
Dynamic Chart
Xiamen Tongfu Microelectronics Co., Ltd. announced that it expects to receive CNY 200 million in funding from Tongfu Microelectronics Co.,Ltd Dec. 18 CI
Tongfu Microelectronics Co.,Ltd Reports Earnings Results for the Nine Months Ended September 30, 2024 24-10-29 CI
Shenzhen Original Advanced Compounds Co., Ltd. agreed to acquire 40.62% stake in Chuzhou Guangtai Semiconductor Industry Development Fund (Limited Partnership) from Tongfu Microelectronics Co.,Ltd. 24-10-23 CI
Shenzhen Original Advanced Compounds Co., Ltd. agreed to acquire 99.97% stake in Advanced Assembly Materials International Ltd. from ASMPT Limited, Shenzhen Leading Semiconductor, Tongfu Microelectronics, Zhang Yan, Shenzhen Haina Foundation Investment, Wu Jie, Hainan Bolin Jingrong Venture Capital, Nanning Advanced Semiconductor, Cheng Yongyang, Ma Jiangtao, Jiaxing Houxi Chenhao Equity Investment, Xinxiu Consulting Management, Hong Kong Zhixin United Company. 24-10-22 CI
Certain A Shares of Beijing Jiaman Dress Co.,Ltd. are subject to a Lock-Up Agreement Ending on 9-SEP-2024. 24-09-08 CI
Tongfu Microelectronics Returns to Profit in H1 as Operating Income Rises 12% 24-08-29 MT
Tongfu Microelectronics Co.,Ltd Reports Earnings Results for the Half Year Ended June 30, 2024 24-08-28 CI
Chinese firms stockpile high-end Samsung chips as they await new US curbs, say sources 24-08-06 RE
Tongfu Microelectronics Agrees to Joint Investment With CITIC Construction Investment 24-07-03 MT
Malaysia targets over $100 bln in semiconductor industry investment 24-05-28 RE
Chinese firms make headway in producing high bandwidth memory for AI chipsets 24-05-15 RE
Chinese firms make headway in producing high bandwidth memory for AI chipsets 24-05-14 RE
Tongfu Microelectronics Co.,Ltd Reports Earnings Results for the First Quarter Ended March 31, 2024 24-04-26 CI
More news
1 day+3.64%
1 week+5.28%
Current month+7.77%
1 month+9.12%
3 months-16.67%
6 months+48.85%
Current year+3.21%
More quotes
1 week
29.21
Extreme 29.21
31.00
1 month
26.90
Extreme 26.9
31.00
Current year
25.90
Extreme 25.9
31.00
1 year
17.88
Extreme 17.88
37.80
3 years
12.36
Extreme 12.36
37.80
5 years
12.36
Extreme 12.36
37.80
10 years
6.96
Extreme 6.96
37.80
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Director TitleAgeSince
Chief Executive Officer 53 2008-04-09
Director of Finance/CFO 50 2023-05-29
Corporate Officer/Principal 60 2011-02-02
Manager TitleAgeSince
Chairman 80 1997-09-30
Director/Board Member 53 2011-02-02
Chairman 74 2010-09-05
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Change 5d. change 1-year change 3-years change Capi.($)
+3.64%+5.28%+41.47%+72.12% 6.33B
-1.06%-1.13%+15.82%+103.27% 99.74B
+3.13%+7.84%+37.08%+298.70% 42.38B
-1.05%-0.95%+8.39%-1.37% 18.17B
+2.25%+3.69%+51.48%+0.85% 5.17B
+1.74%-0.70% - - 4.88B
+5.43%+7.93%+84.40%+17.35% 4.1B
0.00%+6.40%+31.39%+143.24% 4.01B
+2.94%+0.41%+59.51%+222.37% 1.3B
-1.06%+6.56%+14.40%+26.83% 1.1B
Average +1.60%+1.19%+38.21%+98.15% 18.72B
Weighted average by Cap. +0.41%+0.72%+24.11%+133.63%
See all sector performances

Financials

2024 *2025 *
Net sales 23.74B 3.25B 3.14B 2.97B 2.62B 4.65B 282B 5.19B 35.45B 13.08B 117B 12.18B 11.93B 503B 29.61B 4.05B 3.91B 3.7B 3.26B 5.8B 352B 6.47B 44.21B 16.32B 146B 15.19B 14.88B 627B
Net income 811M 111M 107M 101M 89.36M 159M 9.64B 177M 1.21B 447M 4.01B 416M 407M 17.17B 1.32B 181M 175M 166M 146M 259M 15.75B 289M 1.98B 730M 6.55B 680M 666M 28.06B
Net Debt 7.25B 992M 958M 907M 799M 1.42B 86.21B 1.58B 10.83B 4B 35.82B 3.72B 3.64B 154B 5.66B 775M 748M 708M 624M 1.11B 67.31B 1.24B 8.45B 3.12B 27.97B 2.9B 2.85B 120B
More financial data * Estimated data
Logo Tongfu Microelectronics Co.,Ltd
TONGFU MICROELECTRONICS CO., LTD, formerly Nantong Fujitsu Microelectronics Co., Ltd., is a China-based company, principally engaged in the packaging and testing of integrated circuits (ICs). The Company conducts its business within domestic and overseas markets.
Employees
19,975
Calendar
More about the company
Date Price Change Volume
25-02-12 30.50 ¥ +3.64% 109,699,800
25-02-11 29.43 ¥ -2.32% 67,988,920
25-02-10 30.13 ¥ -0.76% 83,191,950
25-02-07 30.36 ¥ +1.50% 126,686,300
25-02-06 29.91 ¥ +3.24% 93,117,680

End-of-day quote Shenzhen S.E., February 11, 2025

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Trading Rating
Investor Rating
ESG MSCI
CCC
More Ratings
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
11
Last Close Price
30.50CNY
Average target price
30.09CNY
Spread / Average Target
-1.36%
Consensus

Quarterly revenue - Rate of surprise

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