Lingsen Precision Industries, Ltd. announced that it expects to receive $3 million in funding
October 12, 2023
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Lingsen Precision Industries, Ltd. announced a private placement to issue common shares for the gross proceeds of $3,000,000 on October 13, 2023. The transaction has been approved by the shareholders of the company. The tranaction will include participation from new investors Lingsen Holding (Samoa)Inc., Li Yuan Investments Co., Ltd. and NINGBO LIYUAN TECHNOLOGY CO.,LTD.
LINGSEN PRECISION INDUSTRIES, LTD. is a Taiwan-based company principally engaged in the packaging, processing, testing and distribution of integrated circuits (ICs) and semiconductor components. The Company mainly operates its businesses through packaging and testing of ICs and semiconductor products, including small outline package (SOP), shrink small outline package (SSOP), thin small outline package (TSOP), thin shrink small outline package (TSSOP), plastic leadless chip carrier (PLCC), quad flat package (QFP), thin quad flat package (TQFP) services, as well as photo detect ICs (PD-ICs) and others. Its products are applied in the consumer electronics, automobile electronic products, memory products, communication equipment and power management products. The Company conducts its businesses primarily in Taiwan, the Americas, the rest of Asia and Europe.