SHENZHEN TECHWINSEMI TECHNOLOGY CO., LTD.

Shenzhen Techwinsemi Technology Co., Ltd.

001309

CNE100005GP9

Semiconductors

End-of-day quote Shenzhen S.E. Other stock markets 06:00:00 2024-05-23 pm EDT			5-day change	1st Jan Change
82.36 ^CNY	-4.27%		-7.33%	+12.83%

Apr. 29	Shenzhen Techwinsemi Technology Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2024	CI
Mar. 19	Shenzhen Techwinsemi Technology Co., Ltd. Approves Cash Dividend for 2023	CI

Shenzhen Techwinsemi Technology Co., Ltd. Approves Cash Dividend for 2022, Payable on 13 July 2023

June 09, 2023 at 03:42 pm EDT

Shenzhen Techwinsemi Technology Co., Ltd. at its Annual General Meeting of 2022 on 08 June 2023, during which the company approved Cash dividend/10 shares (tax included) of CNY 1.87090000. Record date: 12 July 2023; Ex-date: 13 July 2023; Payment date: 13 July 2023.

Latest news about Shenzhen Techwinsemi Technology Co., Ltd.

Shenzhen Techwinsemi Technology Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2024	Apr. 29	CI
Shenzhen Techwinsemi Technology Co., Ltd. Approves Cash Dividend for 2023	Mar. 19	CI
Shenzhen Techwinsemi Technology Co., Ltd. Proposes Final Dividend for the Year 2023	Feb. 27	CI
Shenzhen Techwinsemi Technology Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2023	Feb. 26	CI
Shenzhen Techwinsemi Technology Co., Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2023	23-10-30	CI
Techwinsemi to Form Touch Control JV	23-10-11	MT
Shenzhen Techwinsemi Technology Co., Ltd.(XSEC:001309) added to S&P Global BMI Index	23-09-18	CI
Shenzhen Techwinsemi Technology Co., Ltd. Reports Earnings Results for the Half Year Ended June 30, 2023	23-08-28	CI
Certain A Shares of Shenzhen Techwinsemi Technology Co., Ltd. are subject to a Lock-Up Agreement Ending on 2-JUL-2023.	23-07-01	CI
Shenzhen Techwinsemi Technology Co., Ltd. announced that it expects to receive CNY 1.25 billion in funding	23-06-28	CI
Shenzhen Techwinsemi Technology Co., Ltd. Approves Election of Directors	23-06-09	CI
Shenzhen Techwinsemi Technology Co., Ltd. Approves Cash Dividend for 2022, Payable on 13 July 2023	23-06-09	CI
Shenzhen Techwinsemi Technology Co., Ltd. Proposes Final Dividend for the Year 2022	23-05-04	CI
Shenzhen Techwinsemi Technology Co., Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2023	23-04-28	CI
Shenzhen Techwinsemi Technology Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2022	23-04-28	CI
Li Hu and Xu Daiqun completed the acquisition of 85% of Shenzhen Techwinsemi Optoelectronics Co., Ltd. from Shenzhen Techwinsemi Technology Co., Ltd..	22-12-06	CI
Li Hu and Xu Daiqun signed an Equity Transfer Agreement to acquire 85% of Shenzhen Techwinsemi Optoelectronics Co., Ltd. from Shenzhen Techwinsemi Technology Co., Ltd. for CNY 39 million.	22-11-03	CI
Shenzhen Techwinsemi Technology Co., Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2022	22-10-27	CI
Shenzhen Techwinsemi Technology Co., Ltd. Reports Earnings Results for the Half Year Ended June 30, 2022	22-08-30	CI
Shenzhen Techwinsemi Technology Co., Ltd. has completed an IPO in the amount of CNY 530.8 million.	22-06-28	CI

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Company Profile

Shenzhen Techwinsemi Technology Co Ltd is a China-based company mainly engaged in the design, research, development and application of integrated circuits. The Company is mainly engaged in the design, research and development of flash memory main control chips, the development and optimization of storage module product application solutions, and the sales of storage module products. The Company's products mainly include storage modules such as memory cards, storage disks, and solid-state drives. Its products are mainly used in consumer electronics, industrial control equipment, household appliances, automotive electronics, smart home, Internet of Things (IoT) and other fields.

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Semiconductors

Calendar

2024-08-27 - Q2 2024 Earnings Release (Projected)

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82.36

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