TYAN Storage, Cloud Computing and HPC Solutions to Deliver Exceptional Performance, Power Efficiency and Density at Computex 2016
'Nowadays, operators of enterprises, data centers and cloud server providers seek for solutions with highest performance, the lowest power consumption and the best price-performance ratio for their infrastructure deployment. TYAN's Intel Xeon based solutions can meet the future trend of cloud computing to deliver high performance, low power consumption with a high price-performance ratio to address a wide range of diffident applications,' said Albert Mu, Vice President of MiTAC Computing Technology Corporation's TYAN Business Unit.
Intel Xeon Processor D-1500 Based-Platform to Bring Efficiency and Intelligence to the Storage Market
For the high-efficient, intelligent storage market, TYAN GT62B-B5539 system platform features the new Intel Xeon processor D-1500, a low-power SoC (System-on-Chip) architecture. It is designed to deliver the best performance-per-watt for the storage market. The 1U GT62B-B5539 platform supports Intel Xeon processor D-1500 series CPU with up to 16 cores, 4x DDR4 DIMM slots, 2x 10GbE (Intel X557) and 2x GbE LOM, 1x FH/HL PCI-E x8 slot, 2x mezzanine slots for various options and 10x hot-swap 2.5' storage devices, which include the support up to 4x NVMe devices.
4-socket FT76-B7922 Maximizes the Performance of In-memory Computing for HPC
TYAN FT76-B7922 is the first multi-purpose server platform that simultaneously supports scale-up (fat node) and scale-out (many-core coprocessor node) application scenarios. The platform accommodates 4x Intel Xeon processor E7-8800/4800 v4 CPUs and 4x Intel Xeon Phi 7120P (5110P/3120P) cards or four GPGPUs within the enclosure for typical HPC applications. With 1:1 CPU-to-GPU, or CPU-to-Coprocessor ratio, TYAN FT76-B7922 provides a high price-performance and performance-per-watt for HPC community that both needs CPU- and GPU-intensive computing workloads. The quad-socket Intel Xeon E7-8800/4800 v3/v4 platform is able to offer customers a maximum memory pool that reaches 6TB of RAM when 96x 64GB DDR4 DIMMs are deployed.
Intel Xeon processor E5-2600 v4-based Platform to Deliver Energy Efficient Performance for Datacenters
TYAN also exhibits the latest Intel Xeon processor E5-2600 v4-based servers and motherboards. The dual-socket S7082 motherboard is capable of offering up to 44 cores and 88 threads per motherboard along with 1.5TB of DDR4-2400 memory speed by populating 64GB DIMMs on all slots. The TYAN Xeon E5 platform-based server systems and motherboards enable enterprise and datacenter customers to benefit from the latest advances in cloud computing, HPC, and storage applications.
In order to address critical data in need of higher performance for storage, TYAN takes full advantage of Intel NVMe (Non-volatile memory express) technology, faster IOPS (input/output operations per second) and 6 times performance of a SATA SSD, to highlight the hybrid SSDs storage offerings of GT62B-B5539, GT62B-B7076, GN70-B7086, and TN70B-B7086 storage platforms featuring the support for up to 4x NVMe drives at COMPUTEX.
HPC& Coprocessor applications
-FT76-B7922 : 4U quad-socket Intel Xeon processor E7-8800/4800 v3/v4-based platform with support for up to 4 Intel Xeon Phi™ coprocessor modules, 96x DDR4 DIMM slots, and up to 8x SFF, hot-swap SAS 12Gb/s devices
-FT77C-B7079: 4U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform with support for up to 8 Intel Xeon Phi coprocessor modules, 24x DDR4 DIMM slots, and up to 10x LFF/SFF, hot-swap SATA 6Gb/s devices
-FT48A-B7070: 4U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform supports up to 8x LFF/SFF and 8x SFF, hot-swap SAS/SATA 6Gb/s devices
-GN70-B7086: 2U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform supports up to 8x LFF/SFF, hot-swap SAS 12Gb/s devices, 4 of the bays can support NVMe devices in premium configuration.
-TN70J-E3250 : 2U, SAS 12GB JBOD platform supports up to 12x LFF/SFF, hot-swap SAS 12Gb/s devices
-GT56-B708 6: 1U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform supports up to 10x SFF, hot-swap SAS/SATA 6Gb/s devices
-TN70B-B7086: 2U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform supports up to 12x LFF/SFF, hot-swap SAS 12Gb/s devices, 4 of the bays can support NVMe devices in premium configuration.
-GT62B-B55 39: 1U single-socket Intel Xeon processor D-1500 (SoC) based platform supports up to 10x SFF, hot-swap SAS 12Gb/s devices, 4 of the bays can support NVMe devices in premium configuration.
-GT24B-B5542: 1U single-socket Intel Xeon processor E3-1200 v5-based platform supports up 4x LFF/SFF hot-swap SAS 12Gb/s devices
-GT62B-B7 076: 1U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform supports up to 10x SFF, hot-swap SAS 12Gb/s devices, 4 of the bays can support NVMe devices in premium configuration.
-GT86A-B 7083: 1U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform supports up to 12x LFF/SFF and 1x SFF internal devices
-GT24B- B7076: 1U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform supports up to 4x LFF/SFF hot-swap SAS 12Gb/s devices
-S7082: Dual-socket Intel Xeon processor E5-2600 v3/v4-based server board in EEB (12' x 13') form factor for 2U or pedestal VM server deployment
-S5539: 1U single-socket Intel Xeon processor D-1500-based server board in micro ATX (9.6' x 9.6') form factor for 1U or pedestal low-power storage server deployment
-S7076: Dual-socket Intel Xeon processor E5-2600 v3/v4-based server board in rack-optimized, EATX (12' x 13') form factor for 1U intermediate server deployment
-S7086: Dual-socket Intel Xeon processor E5-2600 v3/v4-based server board in rack-optimized, EATX (12' x 13') form factor for 2U full-featured server deployment
-S5620: Single-socket Intel Xeon processor E5-2600/1600 v3/v4-based server board in ATX (12' x 9.6') form factor for compact server deployment
-S5542: Single-socket Intel Xeon processor E3-1200 v5-based server board in ATX (12' x 9.6') form factor for entry server deployment
-S5545: Single-socket Intel 6th Generation Core™ i3/i5/i7 series processor based board in micro ATX (9.6' x 9.6') form factor for embedded applications
-S5547: Single-socket Intel 6th Generation Core i3/i5/i7 series processor based board in flex ATX (9' x 7.5') form factor for embedded applications
Intel, Xeon and Xeon Phi are trademarks or registered trademarks of Intel Corporation in the United States and other countries.
About TYAN
MiTAC International Corporation published this content on 31 May 2016 and is solely responsible for the information contained herein.
Distributed by Public, unedited and unaltered, on 08 June 2016 05:59:07 UTC.
Original documenthttp://www.mitac.com/news/News_352.aspx
Public permalinkhttp://www.publicnow.com/view/C9B4733F4812617735B8B171CFFB43666BB6F7E2