FOR IMMEDIATE RELEASE: January 4, 2013

CONTACT:
Aeroflex Microelectronic Solutions Aeroflex / Metelics Teresa Farris Pete Ciccarelli MARCOM Manager Product Sales Manager
719-594-8035 603-641-3800 x3272
Teresa.farris@aeroflex.com peter.ciccarelli@aeroflex.comwww.aeroflex.com/metelicsHRC

AEROFLEX / METELICS RECEIVES JANHC and JANKC QUALIFICATION ON 256 DIODE PRODUCTS

Lawrence, MA - Aeroflex / Metelics Hi Rel Components, a division of Aeroflex Incorporated, a wholly owned subsidiary of Aeroflex Holding Corp. (NYSE:ARX), continues its aggressive expansion of their QPL product offering.
"We are extremely proud to announce today that the Defense Logistic Agency (DLA) has issued QPL certification for 256 new JANHC and JANKC Switching and Diode chip products," stated Dr. Francis Kwan, President and General Manager. These newly qualified JANHC and JANKC Switching and Diode product include the following:

Switching Diode Chips qualified per MIL-PRF-19500/116: JANHC, JANKC1N4148 Switching Diode Chips qualified per MIL-PRF-19500/578: JANHC, JANKC1N6638

JANHC, JANKC1N6642
JANHC, JANKC1N6643

Switching Diode Chips qualified per MIL-PRF-19500/609: JANHC, JANKC1N6639

JANHC, JANKC1N6640
JANHC, JANKC1N6641

Zener Diode Chips qualified per MIL-PRF-19500/117: JANHC, JANKC1N962B thru 1N986B Zener Diode Chips qualified per MIL-PRF-19500/127: JANHC, JANKC1N746A thru 1N759A JANHC, JANKC1N4370A thru 1N4372A Zener Diode Chips qualified per MIL-PRF-19500/435: JANHC, JANKC1N4099 thru 1N4135

JANHC, JANKC1N4614 thru 1N4627

Zener Diode Chips qualified per MIL-PRF-19500/437: JANHC, JANKC1N5518B thru 1N5546B

"The qualification of these new JANHC and JANKC parts is very timely as it doubles our portfolio of QPL die just as we are nearing completion of the expansion of both our wafer fabrication and backend processing facilities" added Tim Emery, Vice President of Sales & Marketing.
A copy of the Notification of Qualification letter VQE-13-025333 from DLA is available on the company's web site at www.aeroflex.com/metelicsHRC.
For inquiries regarding pricing and lead times please contact Pete Ciccarelli, Product Sales Manager, at peter.ciccarelli@aeroflex.com.
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About Aeroflex / Metelics Hi-Rel

Aeroflex's Metelics Hi-Rel facility, in Lawrence, MA, offers JAN-qualified TC zeners and hard glass switching
diodes, current regulators, transistors and chips. The facility is DLA Qualified to MIL-PRF-19599N/578 and
/609 and utilizes wafer fabrication foundries as their wafer and die sources. Additional information can be found on the company's website: www.aeroflex.com/metelicsHRC

About Aeroflex

Aeroflex Holding Corp. is a leading global provider of high performance microelectronic components, and test and measurement equipment used by companies in the space, avionics, defense, commercial wireless communications, medical and other markets.

Forward-looking Statements

All statements other than statements of historical fact included in this press release regarding Aeroflex's business strategy and plans and objectives of its management for future operations are forward-looking statements. When used in this press release, words such as "anticipate," "believe," "estimate," "expect," "intend" and similar expressions, as they relate to Aeroflex or its management, identify forward-looking statements. Such forward-looking statements are based on the current beliefs of Aeroflex's management, as
well as assumptions made by and information currently available to its management. Actual results could differ materially from those contemplated by the forward-looking statements as a result of certain factors, including but not limited to, adverse developments in the global economy; changes in government spending; dependence on growth in customers' businesses; the ability to remain competitive in the markets Aeroflex serves; the
inability to continue to develop, manufacture and market innovative, customized products and services that meet customer requirements for performance and reliability; any failure of suppliers to provide raw materials and/or properly functioning component parts; the inability to meet covenants contained in debt agreements; the termination of key contracts, including technology license agreements, or loss of key customers; the inability to protect intellectual property; the failure to comply with regulations such as International Traffic in Arms Regulations and any changes in regulations; the failure to realize anticipated benefits from completed acquisitions, divestitures or restructurings, or the possibility that such acquisitions, divestitures or restructurings could adversely affect Aeroflex; the loss of key employees; exposure to foreign currency exchange rate risks;
and terrorist acts or acts of war. Such statements reflect the current views of management with respect to the future and are subject to these and other risks, uncertainties and assumptions. Aeroflex does not undertake any obligation to update such forward-looking statements. Any projections in this release are based on limited information currently available to Aeroflex, which is subject to change. Although any such projections and the factors influencing them will likely change, Aeroflex will not necessarily update the information, since Aeroflex will only provide guidance at certain points during the year.

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