Asetek announced that ASUS has introduced its third generation of ROG RYUJIN all-in-one CPU coolers for high-end builds, leveraging the superior thermal and acoustic performance and reliability associated with Asetek's most advanced technology to date. The RYUJIN III 240/360 and RYUJin III 240/360 ARGB CPU coolers combine extreme overclocking capability, silent operation, and next-gen aesthetics to provide the ultimate in gameplay experiences and next-level performance. The newest iterations of ROG's fan-favorite line of RYUJIN Series feature an expansive full color 3.5-inch display that can be programmed for unique personalization and advanced system monitoring of crucial system information such as clock frequencies, voltages, temperatures, fan speeds, water flow, or custom GIFs.

Compatible with the latest Intel and AMD sockets, the RYUJIN III AIOs are available in 240mm and 360mm radiator sizes for a variety of form factors and cooling requirements and include either 120mm Noctua fans or ROG's customizable ARGB magnetic daisy-chainable fans for easy installation and cable management, high-velocity airflow, and extreme cooling. This generation of ROG AIO coolers now includes software for control of the pump and embedded fans. Designed from the ground up and optimized for Intel 12th and 13th Gen processors as well as AMD RyzenT 7000 and 5000 Series processors, Asetek's latest liquid cooling technology includes a plethora of innovations that deliver up to 2C/100W improvement over its 7th generation of liquid cooling technology.

By focusing on how the individual components that constitute an all-in-one liquid cooler interact with each other and how collectively they affect performance, Asetek's most advanced Technology to date includes: A new performance-engineered pump featuring a 3-phase motor for higher flow and quieter operation; Larger diameter rubber tubes, larger HEX tubes and tanks, as well as wider and smoother flow paths in the pump to reduce impedance; A newly designed square cold plate optimized for the latest Intel and AMD processors; Optimized HEX designs that increase overall surface area and, at the same time, reduce air flow impedance; Under-the-hood system enhancements resulting in even quieter operation versus previous generations.