Presto Engineering and Cadence Design Systems, Inc. announced a collaboration to broaden semiconductor package design solutions and expertise for high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets. Presto is adopting the Cadence® system design and analysis portfolio for advanced IC packaging, which includes the CadenceAllegro® X Package Designer Plus, Clarity™ 3D Solver, Sigrity™ XtractIM™ technology and Celsius™ Thermal Solver, on an exclusive basis in order to design IC packaging solutions for its automotive and IoT customers. In addition, Presto plans to provide Cadence with input on software features, functions and workflows specific to Cadence’s end customer and market needs. Presto’s ability to provide a full suite of analytical qualification services within a single facility further reduces the time to market for its customers. The Cadence system design and analysis portfolio for advanced IC packaging supports Cadence’s Intelligent System Design™ strategy, enabling SoC design excellence. Now, with the addition of the Cadence portfolio, Presto offers a full set of design and qualification tools to help customers achieve the most efficient design-for-manufacturing process, strengthening its position as the Trusted Microelectronics Partner.