Hosiden Corporation : ?3.5 mm Reflow Soldering-compatible Waterproof Jack, the Smallest Class in the Industry, has been developed.
January 20, 2013 at 07:57 pm EST
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?3.5 mm Reflow Soldering-compatible Waterproof Jack, the Smallest Class in the Industry, has been developed.
In order to meet the waterproof needs of small mobile devices like smartphones, Hosiden has developed and started supplying samples of SMT-compliant small waterproof jack, which is one of the smallest classes in the industry.
The original structure using special potting materials and packing has ensured the waterproof performance (IPX7) of the jack part, without the work like applying sealing materials after SMT board mounting. As the jack is reflow soldering-compatible, effective mounting is possible.
It can support customized designs and the sleeve shape can be changed in accordance with the designs.
Model Name and Number
Typical Features
Waterproof performance (IPX7) of the jack part, without the work like applying sealing materials, has been ensured.
Board mounting by reflow soldering is possible, as it is of a SMT type.
Mounting into FPC is also possible.
It is of 4-pole switch circuit design and selective use of three circuits is possible, too.
Hosiden Corporation is principally engaged in the manufacture and sale of electronic components. The Company has four business segments. The Mechanical Component segment provides connectors, jacks and switches. The Acoustic segment offers microphones, headphones, headsets, speakers and receivers. The Liquid Crystal Display Device segment provides passive liquid crystal display devices. The Composite Part and Others segment offers remote controllers and solenoids.
HOSIDEN CORPORATION 
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