Marubun Corporation

7537

JP3877500003

Semiconductors

Market Closed - Japan Exchange Other stock markets 02:00:00 2024-05-10 am EDT			5-day change	1st Jan Change
1,436 ^JPY	-0.21%		-0.90%	-11.14%

2023	Marubun Corporation Provides Dividend Guidance for the Year Ending March 31, 2024	CI
2023	Marubun Corporation Provides Consolidated Earnings Guidance for the Six Months Ending September 30, 2023 and Fiscal Year Ending March 31, 2024	CI

EYs3D Microelectronics Technology, Inc. announced that it has received $7 million in funding from ARM Holdings plc, Investment Arm, WI Harper Group, Marubun Corporation

May 25, 2021

eYs3D Microelectronics Technology, Inc. announced that it has received $7 million in a round of funding on May 26, 2021. The transaction included participation from Arm IoT Fund, a fund managed by ARM Holdings plc, Investment Arm, WI Harper Group, and Marubun Corporation (TSE:7537).

Latest news about Marubun Corporation

Marubun Corporation Provides Dividend Guidance for the Year Ending March 31, 2024	23-07-30	CI
Marubun Corporation Provides Consolidated Earnings Guidance for the Six Months Ending September 30, 2023 and Fiscal Year Ending March 31, 2024	23-07-30	CI
Marubun Corporation Provides Dividend Guidance for the Second Quarter of Fiscal Year Ending March 31, 2024	23-07-30	CI
Marubeni to Invest in Bison Low Carbon Ventures -- OPIS	23-07-17	DJ
Marubun to Grant Restricted Stock Compensation	23-06-30	MT
Marubun Corporation Announces Dividend for the Year Ended March 31, 2023 and Provides Dividend Guidance for the Second Quarter Ending September 30, 2023	23-05-18	CI
Marubun Corporation Provides Year End Dividend Guidance for the Year Ending March 31, 2024	23-05-18	CI
Marubun Corporation Provides Consolidated Earnings Guidance for the Six Months Ending September 30, 2023 and Year Ending March 31, 2024	23-05-18	CI
Marubun Corporation Announces Dividend for the Fiscal Year Ended March 31, 2023, Payable on June 29, 2023	23-05-18	CI
Marubun Corporation Reports Earnings Results for the Full Year Ended March 31, 2023	23-05-12	CI
Marubun Corporation Provides Dividend Guidance for the Year Ending March 31, 2023	23-02-09	CI
Marubun Corporation Provides Earnings Guidance for the Fiscal Year Ending March 31, 2023	23-02-09	CI
Fujitsu Semiconductor Memory Solution, Marubun and Ossia Partner to Announce Cota® Real Wireless Power™ ePaper RFID Tags	23-01-05	CI
Marubun Corporation Provides Consolidated Earnings Guidance for the Fiscal Year Ending March 31, 2023	22-11-09	CI
Marubun Corporation Declares Dividend for the Second Quarter Ended September 30, 2022; Provides Dividend Guidance for the Fiscal Year Ending March 31, 2023	22-11-09	CI
Marubun Corporation Provides Dividend Guidance for the Fourth Quarter Ending March 31, 2022	22-02-08	CI
PCTEL Says Japanese Partner Now Offering Its Gflex Scanning Receiver	22-01-11	MT
Marubun Corporation and Ossia Inc. Combine Forces to Develop Wireless Power Sensor Receiver for Broad Applications	21-12-02	CI
Marubun Corporation Revises Earning Guidance for the Year Ending March 31, 2022	21-10-29	CI
Marubun Corporation Reports Consolidated Earnings Results for the First Quarter Ended June 30, 2021	21-08-10	CI
Marubun Corporation Provides Consolidated Earnings Guidance for the Six Months Ending September 30, 2021 and Full Year Ending March 31, 2022	21-08-10	CI
Marubun Corporation Provides Dividend Guidance for the Second Quarter Ending September 30, 2021 and Full Year Ending March 31, 2022	21-08-10	CI
EYs3D Microelectronics Technology, Inc. announced that it has received $7 million in funding from ARM Holdings plc, Investment Arm, WI Harper Group, Marubun Corporation	21-05-25	CI
Marubun Widens Loss in FY21	21-05-25	MT
Marubun Ups FY21 Revenue Outlook, Projects Loss to Widen on Foreign Exchange Loss	21-05-19	MT

Chart Marubun Corporation

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Company Profile

MARUBUN CORPORATION is a Japan-based company mainly engaged in the purchase and sale of semiconductors, electronic components, electronic equipment and other domestic and foreign electronics products. The Company operates through two business segments. The Device segment is engaged in the sale of semiconductors, including analog integrated circuits (ICs), standard logic ICs, memory ICs, microprocessors, special-purpose ICs, and custom ICs, as well as electronic components such as display panels, crystal units, connectors, printed circuit boards, and modules. The Systems segment is engaged in the sale of aerospace equipment, industrial equipment, laser equipment, information and communication equipment, and medical equipment. The Company is also engaged in the provision of maintenance and technical services for electronic equipment.

Sector

Semiconductors

Calendar

2024-05-09 - Q4 2023 Earnings Release

More about the company

	1st Jan change	Capi.
MARUBUN CORPORATION	-11.14%	242M
WPG HOLDINGS LIMITED	+12.87%	4.64B
WT MICROELECTRONICS CO., LTD.	+8.00%	3.35B
MACNICA HOLDINGS, INC.	-11.74%	2.62B
SUPREME ELECTRONICS CO., LTD.	+30.74%	1.43B
RYOYO RYOSAN HOLDINGS,INC.	0.00%	1.05B
TOKYO ELECTRON DEVICE LIMITED	-4.04%	958M
WAH LEE INDUSTRIAL CORPORATION	+32.86%	947M
CHANG WAH ELECTROMATERIALS INC.	+32.38%	905M
WUHAN P&S INFORMATION TECHNOLOGY CO., LTD.	-13.78%	858M

Semiconductor Wholesale

Marubun Corporation

Equities

7537

JP3877500003

Semiconductors

EYs3D Microelectronics Technology, Inc. announced that it has received $7 million in funding from ARM Holdings plc, Investment Arm, WI Harper Group, Marubun Corporation

Latest news about Marubun Corporation

Chart Marubun Corporation

Company Profile

Income Statement Evolution

Quarterly earnings - Rate of surprise

Sector Semiconductor Wholesale