Revasum Inc. and Asahi Diamond America, Inc. announced their strategic collaboration aimed at enhancing silicon carbide (SiC) wafer grinding. The collaboration centers around the utilization of Revasum's 7AF-HMG Silicon Carbide Grinder, a solution specifically designed for the unique challenges posed by 150mm and 200mm silicon carbide wafers. This collaboration brings together Revasum's expertise in semiconductor grinding and Asahi Diamond America's cutting-edge abrasive technology, marking a significant step forward in silicon carbide wafer manufacturing.

The 7AF-HMG is distinguished by its hard material optimized grind engine that quickly and precisely thins and planarizes 150mm and 200mm silicon carbide wafers. Its advanced features and precision make it a game changer in the industry, ensuring highly efficient and productive processing of bare substrates and device wafers at customer facilities.