Samsung Electro Mechanics : New MLCC released 0603 inch 1㎋ 250V for Samsung Electro-Mechanics automotive series
September 13, 2023
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Tech - Article2023.09.14
New MLCC released 0603 inch 1㎋ 250V for Samsung Electro-Mechanics automotive series
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0603 inch (1.6×0.8mm) size, C0G (-55 to 125℃), capacitance of 1㎋ at rated 250V
▷ Developed and started mass production of the multilayer ceramic capacitor CL10C102JE81PN# applicable for Powertrain/ Safety of automobiles.
▷ The number of MLCCs installed in a vehicle is rapidly increasing due to the electrification and high functionality of automobiles. For this reason, miniaturization, stability, and capacitance expansion of MLCC are continuously required.
▷ Accordingly, Samsung Electro-Mechanics developed the C0G 1㎋ in 0603 inch (1.6 x 0.8mm) size and rated at 250V by applying its own ceramic and electrode material atomization and ultra-precision lamination method, expanding the C0G lineup from 50V to 250V.
Samsung
Size
Capacitance
Rated Voltage
* TCC
CL10C102JE81PN#
0603 inch
1㎋
250V
C0G
*TCC : Temperature Coefficient of Capacitance
*C0G: Capacitance change rate 0±30ppm/℃ in the temperature range of -55℃~125℃
Characteristics data
▶ Product details can be found here.
▶ Inquiries: Please click here for product related inquiries.
▶ For the Samsung Electro-Mechanics vehicle product lineup, please see here.
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Samsung Electro-Mechanics Co. Ltd. published this content on 14 September 2023 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 25 September 2023 06:30:04 UTC.
Samsung Electro-Mechanics Co Ltd is a Korea-based company mainly engaged in the manufacture and distribution of electronic components. The Company operates its business through three segments. The Component Solution segment is involved in the production and sale of passive elements such as multi layers ceramic capacitors (MLCC), inductors, chip resistors. The Module Solution segment is involved in the production and sale of module products, including camera modules and communication modules. The Board Solution segment is involved in the production and sale of semiconductor package substrates and high-density multilayer boards. The Company distributes its products in domestic and overseas markets such as America, Europe and Southeast Asian countries, China and Japan.
SAMSUNG ELECTRO-MECHANICS CO., LTD. 
