Samsung Electro Mechanics : New MLCC released 1206 inch 10㎌ 50V for Samsung Electro-Mechanics automotive series
November 09, 2023
Share
Tech - Article2023.11.10
New MLCC released 1206 inch 10㎌ 50V for Samsung Electro-Mechanics automotive series
Close
Share on Facebook
Copy url
1206 inch (3.2×1.6mm) size, X7R (-55 to 125℃), capacitance of 10㎌ at rated 50V
▷ Developed and started mass production of the multilayer ceramic capacitor CL31B106KBK6PJ# applicable for Powertrain/ Safety of automobiles. Samples are also available.
▷ The number of MLCCs installed in a vehicle is rapidly increasing due to the electrification and high functionality of automobiles. For this reason, miniaturization, stability, and capacitance expansion of MLCC are continuously required.
▷ Samsung Electro-Mechanics developed the X7R 10㎌ in 1206 inch (3.2×1.6mm) size and rated at 50V by applying its own ceramic and electrode material atomization and ultra-precision lamination method.
Samsung
Size
Capacitance
Rated Voltage
* TCC
CL31B106KBK6PJ#
1206 inch
10㎌
50V
X7R
*TCC : Temperature Coefficient of Capacitance
*X7R : Capacitance change rate ±15% in the temperature range of -55℃~125℃, X7S: ±22%, X7T: +22% / -33%
Characteristics data
▶ Product details can be found here.
▶ Inquiries: Please click here for product related inquiries.
▶ For the Samsung Electro-Mechanics vehicle product lineup, please see here.
Related Articles
Tech2023.10.12
New MLCC released 0402 inch 1000pF(1㎋) 50V for Samsung Electro-Mechanics automotive series
Tech2023.09.14
New MLCC released 0603 inch 1㎋ 250V for Samsung Electro-Mechanics automotive series
Tech2023.08.03
New MLCC released 0603 inch 22㎌ 6.3V for Samsung Electro-Mechanics automotive series
Samsung Electro-Mechanics Co. Ltd. published this content on 10 November 2023 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 21 November 2023 00:27:02 UTC.
Samsung Electro-Mechanics Co Ltd is a Korea-based company mainly engaged in the manufacture and distribution of electronic components. The Company operates its business through three segments. The Component Solution segment is involved in the production and sale of passive elements such as multi layers ceramic capacitors (MLCC), inductors, chip resistors. The Module Solution segment is involved in the production and sale of module products, including camera modules and communication modules. The Board Solution segment is involved in the production and sale of semiconductor package substrates and high-density multilayer boards. The Company distributes its products in domestic and overseas markets such as America, Europe and Southeast Asian countries, China and Japan.