Texas Instruments broke ground on its new 300-mm semiconductor wafer fabrication plants (or "fabs") in Sherman, Texas. In a ceremony attended by elected officials and community leaders, TI Chairman, President and CEO Rich Templeton celebrated the start of construction on the large private-sector economic investment in Texas history and reiterated the company's commitment to expanding its internal manufacturing capacity for the long term. The potential $30 billion investment includes plans for four fabs to meet demand over time, supporting as many as 3,000 direct jobs.

The new fabs will manufacture tens of millions of analog and embedded processing chips daily that will go into electronics everywhere. The company has a long-standing commitment to responsible, sustainable manufacturing. The new fabs will be designed to meet one of the Leadership in Energy and Environmental Design (LEED) building rating system's high levels of structural efficiency and sustainability: LEED Gold.

Advanced 300-mm equipment and processes in Sherman will further reduce waste, water and energy consumption.