Tong Hsing Electronic Industries, Ltd.

6271

TW0006271000

Semiconductors

End-of-day quote Taiwan S.E. Other stock markets 06:00:00 2024-04-25 pm EDT			5-day change	1st Jan Change
143.5 ^TWD	0.00%		+1.06%	-8.89%

Apr. 19	Tong Hsing Electronic Industries, Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2024	CI
Apr. 09	Tong Hsing Electronic Industries, Ltd. Reports Consolidated Sales for March 2024	CI

Tong Hsing Electronic Industries, Ltd. Announces the resignation of Lee Tsung Hsien as Chief Internal Auditor of the Company

February 29, 2024 at 06:25 am EST

Tong Hsing Electronic Industries, Ltd. announced the resignation of Lee Tsung Hsien as Chief Internal Auditor of the Company, effective February 29, 2024.

Latest news about Tong Hsing Electronic Industries, Ltd.

Tong Hsing Electronic Industries, Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2024	Apr. 18	CI
Tong Hsing Electronic Industries, Ltd. Reports Consolidated Sales for March 2024	Apr. 09	CI
Tong Hsing Electronic Industries, Ltd. Announces Consolidated Sales Results for the Month of February 2024	Mar. 08	CI
Tong Hsing Electronic Industries, Ltd. Resolves to Change the Company's Registered Business Address	Feb. 29	CI
Tong Hsing Electronic Industries, Ltd. Announces the resignation of Lee Tsung Hsien as Chief Internal Auditor of the Company	Feb. 29	CI
Tong Hsing Electronic Industries, Ltd. Reports Earnings Results for the Full Year Ended December 31, 2023	Feb. 29	CI
Tong Hsing Electronic Industries, Ltd. Announces Consolidated Sales Results for the Month of January 2024	Feb. 08	CI
Tong Hsing Electronic Industries, Ltd. Announces Consolidated Sales Results for the Month of December 2023	Jan. 09	CI
Tong Hsing Electronic Industries, Ltd. Reports Consolidated Sales for the Month of October 2023	Nov. 09	CI
Tong Hsing Electronic Industries, Ltd. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023	23-10-26	CI
Tong Hsing Electronic Industries, Ltd. Announces Consolidated Sales for the Month of August 2023	23-09-08	CI
Tong Hsing Electronic Industries, Ltd. Announces Consolidated Sales Results for the Month of July 2023	23-08-09	CI
Tong Hsing Electronic Industries, Ltd. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023	23-07-24	CI
Tong Hsing Electronic Industries, Ltd. Reports Sales Result for the Month of June 2023	23-07-07	CI
Tong Hsing Electronic Industries, Ltd. Reports Sales Result for the Month of May 2023	23-06-09	CI
Tong Hsing Electronic Industries, Ltd. Reports Consolidated Sales Results for the Month of April 2023	23-05-09	CI
Tong Hsing Electronic Industries, Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2023	23-04-25	CI
Tong Hsing Electronic Industries, Ltd. Reports Consolidated Sales Results for the Month of March 2023	23-04-07	CI
Tong Hsing Electronic Industries, Ltd. Reports Consolidated Sales for the Month of February 2023	23-03-09	CI
Tong Hsing Electronic Industries, Ltd. Reports Consolidated Sales for the Month of January 2023	23-02-09	CI
Tong Hsing Electronic Industries, Ltd. Reports Consolidated Sales for the Month December 2022	23-01-09	CI
Tong Hsing Electronic Industries, Ltd. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2022	22-11-10	CI
Tong Hsing Electronic Industries, Ltd. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2022	22-08-10	CI
Tong Hsing Electronic Industries, Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2022	22-04-26	CI
Tong Hsing Electronic Industries, Ltd. Reports Earnings Results for the Full Year Ended December 31, 2021	22-03-21	CI

Chart Tong Hsing Electronic Industries, Ltd.

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Tong Hsing Electronic Industries Ltd is a Taiwan-based company principally engaged in the research, development, manufacture and sales of ceramic circuit boards and image products. The Company's main products include power amplifier modules, ceramic heat sink substrates, hybrid integrated circuits, wafer reorganization, wafer testing, micro display modules, and others. High-frequency wireless communication modules are mainly used in mobile phones, wireless local area networks. The hybrid body circuit mainly uses ceramic circuit boards for the product assembly process, which is divided into thick film and thin film technologies. The ceramic circuit boards are mainly used in aviation, automotive, and medical fields. The imaging products are mainly used in digital cameras, digital cameras, mobile phones and tablet computers. The Company distributes its products to the Americas, Europe and other markets.

Sector

Semiconductors

Calendar

2024-05-29 - Annual General Meeting

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Investor Rating

ESG Refinitiv

B-

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Analysts' Consensus

Sell

Buy

Mean consensus

OUTPERFORM

Number of Analysts

Last Close Price

143.5 TWD

Average target price

164.2 TWD

Spread / Average Target

+14.40%

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Quarterly earnings - Rate of surprise

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