Announcement of the Company's 2021 Consolidated Financial
Statements has been approved by the Board of Directors.
Date of events
2022/02/22
To which item it meets
paragraph 31
Statement
1.Date of submission to the board of directors or approval by the board of
directors:2022/02/22
2.Date of approval by the audit committee:2022/02/22
3.Start and end dates of financial reports or annual self-assessed financial
information of the reporting period (XXXX/XX/XX~XXXX/XX/XX):
2021/01/01~2021/12/31
4.Operating revenue accumulated from 1/1 to end of the period
(thousand NTD):8,118,256
5.Gross profit (loss) from operations accumulated from 1/1 to end of
the period (thousand NTD):449,332
6.Net operating income (loss) accumulated from 1/1 to end of the period
(thousand NTD):55,517
7.Profit (loss) before tax accumulated from 1/1 to end of the period
(thousand NTD):206,738
8.Profit (loss) accumulated from 1/1 to end of the period
(thousand NTD):118,732
9.Profit (loss) during the period attributable to owners of parent
accumulated from 1/1 to end of the period (thousand NTD):219,897
10.Basic earnings (loss) per share accumulated from 1/1 to end of
the period (NTD):0.43
11.Total assets end of the period (thousand NTD):21,517,385
12.Total liabilities end of the period
(thousand NTD):10,279,133
13.Equity attributable to owners of parent end of the
period (thousand NTD):10,940,386
14.Any other matters that need to be specified:None.
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Walton Advanced Engineering Inc. published this content on 22 February 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 22 February 2022 10:30:08 UTC.
WALTON ADVANCED ENGINEERING, INC. is a Taiwan-based company principally engaged in the packaging and testing business. The Company mainly provides assembly and testing services. The Company provides thin small-outline package (TSOP) integrated circuits (ICs), ball grid array (BGA) ICs, multi-chip stacking package (MCP), chip scale package (CSP) and trench BGA, flash memory products, micro-secure digital (SD) cards, memory modules, universal serial bus (USB), three dimensional (3D) stack up products and package on package (POP) products, among others. The Company distributes its products within domestic market and to overseas markets.