The fingernail-size Intel chip with Foveros technology is a first-of-its kind.
With Foveros, processors are built in a totally new way: not with the various IPs spread out flat in two dimensions, but with them stacked in three dimensions. Think of a chip designed as a layer cake (a 1-millimeter-thick layer cake) versus a chip with a more-traditional pancake-like design. Intel's Foveros advanced packaging technology allows Intel to 'mix and match' technology IP blocks with various memory and I/O elements all in a small physical package for significantly reduced board size. The first product designed this way is 'Lakefield,' the Intel Core processor with Intel hybrid technology.
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For its part, Lakefield represents an entirely new class of chip. It delivers an optimal balance of performance and efficiency with best-in-class connectivity in a small footprint - Lakefield's package area measures just 12-by-12-by-1 millimeters. Its hybrid CPU architecture combines power-efficient 'Tremont' cores with a performance scalable 10nm 'Sunny Cove' core to intelligently deliver productivity performance when needed and power-sipping efficiency when not needed for long battery life.
These benefits offer original equipment manufacturers more flexibility for thin-and-light form factor PCs, including the emerging dual-screen and foldable screen PC categories.
Recently, three designs have been announced that are powered by Lakefield and were co-engineered with Intel. In
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