The recently published Bluetooth SIG 2022 market update forecasts that the number of Bluetooth audio streaming device shipments will grow at a 7% CAGR to reach 1.8 billion annual shipments by 2026, with earbud shipments growing 3X in that time. The new Auracast broadcast audio, that is part of the Bluetooth LE Audio specification, is set to open significant new opportunities for innovation, including the enablement of personal and location-based audio sharing. Potential use case examples include flight-specific audio broadcasts at an airport, multi-language options at the movie theater or museum and a host of assistance features in public spaces for the hearing impaired that can be broadcast directly to hearing aids.
CEVA is the leading provider of Bluetooth platform IP solutions for integration into SoCs, powering billions of Bluetooth-enabled devices to date. CEVA offers both Bluetooth LE and Dual Mode IP platforms, including baseband controller, radio and full software protocol stack, compliant with Bluetooth 5.3, LE Audio and Auracast. To further simplify the development of wireless audio devices, CEVA's Bluebud Bluetooth audio turnkey platform offers a complete wireless audio experience, targeting TWS earbuds, smartwatches, wireless microphones and speakers. Bluebud combines Bluetooth, audio and sensing IPs in a single, integrated solution, along with a comprehensive list of audio codecs, including LC3, (m)SBC, CVSD, AAC, MP3, voice processing algorithms such as ClearVox for noise reduction and echo cancellation, WhisPro for speech recognition and MotionEngine Hear for Spatial Audio and motion sensing. For more information on how CEVA can work with you to create your next-generation wireless audio SoC via best-in-class IP and chip design expertise, contact info@ceva-dsp.com.
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CEVA is the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions for a smarter, safer, connected world. We provide Digital Signal Processors, AI engines, wireless platforms, cryptography cores and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence. These technologies are offered in combination with our Intrinsix IP integration services, helping our customers address their most complex and time-critical integrated circuit design projects. Leveraging our technologies and chip design skills, many of the world's leading semiconductors, system companies and OEMs create power-efficient, intelligent, secure and connected devices for a range of end markets, including mobile, consumer, automotive, robotics, industrial, aerospace & defense and IoT.
Our DSP-based solutions include platforms for 5G baseband processing in mobile, IoT and infrastructure, advanced imaging and computer vision for any camera-enabled device, audio/voice/speech and ultra-low-power always-on/sensing applications for multiple IoT markets. For sensor fusion, our
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