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    CEVA   US1572101053

CEVA, INC.

(CEVA)
  Report
Delayed Nasdaq  -  04:00 2022-11-30 pm EST
27.17 USD   +4.58%
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11/15CEVA, Inc. Introduces Voice User Interface Solution for TI SimpleLink™ Wi-Fi® Wireless MCUs
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CEVA Bluetooth® 5.3 Platform IP Supports New Auracast™ Broadcast Audio, Transforming the Shared Audio Experience

06/08/2022 | 11:54am EST

ROCKVILLE, MD - CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, announced that it's latest RivieraWaves Bluetooth® 5.3 IP family now supports Auracast(TM) broadcast audio, the new audio sharing standard, based on the Bluetooth LE Audio broadcasting specification, unveiled by the Bluetooth Special Interest Group (SIG) today. Auracast broadcast audio is set to transform the shared audio experience, enabling an unlimited number of Auracast receiver-compliant devices such as TWS earbuds, headphones, hearing aids and wireless speakers to simultaneously receive audio broadcast from one or several Auracast transmitter devices.

The recently published Bluetooth SIG 2022 market update forecasts that the number of Bluetooth audio streaming device shipments will grow at a 7% CAGR to reach 1.8 billion annual shipments by 2026, with earbud shipments growing 3X in that time. The new Auracast broadcast audio, that is part of the Bluetooth LE Audio specification, is set to open significant new opportunities for innovation, including the enablement of personal and location-based audio sharing. Potential use case examples include flight-specific audio broadcasts at an airport, multi-language options at the movie theater or museum and a host of assistance features in public spaces for the hearing impaired that can be broadcast directly to hearing aids.

Tal Shalev, Vice President and General Manager of the Wireless IoT BU at CEVA, commented: "We welcome the introduction of Auracast broadcast audio that will transform the way we share audio, privately and in public areas. CEVA has contributed to the evolution of the Bluetooth standard and is proud to have licensed its Bluetooth LE and Dual Mode technologies, including Auracast solutions, to major semiconductor companies and OEMs for various applications including wireless headsets, TWS earbuds, hearing aids, smartwatches, speakers and microphones."

CEVA is the leading provider of Bluetooth platform IP solutions for integration into SoCs, powering billions of Bluetooth-enabled devices to date. CEVA offers both Bluetooth LE and Dual Mode IP platforms, including baseband controller, radio and full software protocol stack, compliant with Bluetooth 5.3, LE Audio and Auracast. To further simplify the development of wireless audio devices, CEVA's Bluebud Bluetooth audio turnkey platform offers a complete wireless audio experience, targeting TWS earbuds, smartwatches, wireless microphones and speakers. Bluebud combines Bluetooth, audio and sensing IPs in a single, integrated solution, along with a comprehensive list of audio codecs, including LC3, (m)SBC, CVSD, AAC, MP3, voice processing algorithms such as ClearVox for noise reduction and echo cancellation, WhisPro for speech recognition and MotionEngine Hear for Spatial Audio and motion sensing. For more information on how CEVA can work with you to create your next-generation wireless audio SoC via best-in-class IP and chip design expertise, contact info@ceva-dsp.com.

About CEVA, Inc.

CEVA is the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions for a smarter, safer, connected world. We provide Digital Signal Processors, AI engines, wireless platforms, cryptography cores and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence. These technologies are offered in combination with our Intrinsix IP integration services, helping our customers address their most complex and time-critical integrated circuit design projects. Leveraging our technologies and chip design skills, many of the world's leading semiconductors, system companies and OEMs create power-efficient, intelligent, secure and connected devices for a range of end markets, including mobile, consumer, automotive, robotics, industrial, aerospace & defense and IoT.

Our DSP-based solutions include platforms for 5G baseband processing in mobile, IoT and infrastructure, advanced imaging and computer vision for any camera-enabled device, audio/voice/speech and ultra-low-power always-on/sensing applications for multiple IoT markets. For sensor fusion, our Hillcrest Labs sensor processing technologies provide a broad range of sensor fusion software and inertial measurement unit ("IMU") solutions for markets including hearables, wearables, AR/VR, PC, robotics, remote controls and IoT. For wireless IoT, our platforms for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6/6E (802.11n/ac/ax), Ultra-wideband (UWB), NB-IoT and GNSS are the most broadly licensed connectivity platforms in the industry.

Visit us at www.ceva-dsp.com

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(C) 2022 M2 COMMUNICATIONS, source M2 PressWIRE

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Financials (USD)
Sales 2022 134 M - -
Net income 2022 -21,6 M - -
Net cash 2022 154 M - -
P/E ratio 2022 -30,3x
Yield 2022 -
Capitalization 630 M 630 M -
EV / Sales 2022 3,56x
EV / Sales 2023 3,30x
Nbr of Employees 476
Free-Float 94,4%
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Mean consensus BUY
Number of Analysts 7
Last Close Price 27,17 $
Average target price 35,71 $
Spread / Average Target 31,4%
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Managers and Directors
Gideon Wertheizer EVP & General Manager-DSP Business Unit
Yaniv Arieli CFO, Treasurer & Chief Accounting Officer
Peter McManamon Director
Erez Bar-Niv Chief Technology Officer
Arik Shmayovitsh Vice President-Research & Development
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