Chipbond Technology Corporation

6147

TW0006147002

Semiconductors

End-of-day quote Taipei Exchange Other stock markets 06:00:00 2024-04-28 pm EDT			5-day change	1st Jan Change
77.3 ^TWD	-0.64%		+5.46%	+6.92%

Apr. 26	Chipbond Technology Corporation Reports Earnings Results for the First Quarter Ended March 31, 2024	CI
Apr. 15	E Ink Holdings Inc. Teams Up with Realtek Semiconductor, Integrated Solutions Technology and Chipbond Technology Corporation to Develop Next-Generation ePaper Shelf Labels	CI

Chipbond Technology Corporation announced that it expects to receive TWD 300.87266 million in funding from Hua Chen Investment Co., Ltd

July 14, 2022

Chipbond Technology Corporation announced a private placement of 4,462,000 common shares at a price of TWD 67.43 per share to returning investor Hua Chen Investment Co., Ltd for gross proceeds of TWD 300,880,000 on July 15, 2022. After completion of the transaction, Hua Chen Investment Co., Ltd will hold 8,910,000 shares worth TWD 606,009,000 in the company representing 1.21% stake.

Latest news about Chipbond Technology Corporation

Chipbond Technology Corporation Reports Earnings Results for the First Quarter Ended March 31, 2024	Apr. 25	CI
E Ink Holdings Inc. Teams Up with Realtek Semiconductor, Integrated Solutions Technology and Chipbond Technology Corporation to Develop Next-Generation ePaper Shelf Labels	Apr. 15	CI
Chipbond Technology Corporation Reports Earnings Results for the Full Year Ended December 31, 2023	Feb. 21	CI
Chipbond Technology Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023	23-10-26	CI
Chipbond Technology Corporation Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023	23-07-27	CI
Chipbond Technology Corporation Announces Cash Dividend, Payable on July 14, 2023	23-06-01	CI
Chipbond Technology Corporation Reports Earnings Results for the First Quarter Ended March 31, 2023	23-04-26	CI
Chipbond Technology Corporation Reports Earnings Results for the Full Year Ended December 31, 2022	23-02-24	CI
Chipbond Technology Corporation Announces Resignation of Fei-Jain Wu as CEO	22-12-23	CI
Chipbond Technology Corporation Acquires Batch of TWD 500 Million Machinery Equipment	22-11-02	CI
Chipbond Technology Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2022	22-10-28	CI
Chipbond Technology Corporation Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2022	22-07-29	CI
Hua Chen Investment Co., Ltd agreed to acquire a.604054% stake in Chipbond Technology Corporation for approximately HKD 300 million.	22-07-14	CI
Chipbond Technology Corporation announced that it expects to receive TWD 300.87266 million in funding from Hua Chen Investment Co., Ltd	22-07-14	CI
Chipbond Technology Corporation Announces the Cash Dividend, Payable on August 12, 2022	22-06-17	CI
Chipbond Technology Corporation Appoints Oliver Chang as Institutional Director	22-05-27	CI
Chipbond Technology Corporation Reports Earnings Results for the First Quarter Ended March 31, 2022	22-04-29	CI
Chipbond Technology Corporation Reports Earnings Results for the Full Year Ended December 31, 2021	22-02-28	CI
Chipbond Technology Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2021	21-10-26	CI
United Microelectronics : Tech Stocks Rise As Investors Chase Growth After August Jobs Report Disappoints	21-09-03	MT
Sector Update: Tech	21-09-03	MT
DJ Industrial : Wall Street Treads Water Pre-Bell as US Jobs Growth Slows in August	21-09-03	MT
DJ Industrial : US Futures Flat Ahead of August Jobs Report	21-09-03	MT
Chipbond Technology Corporation Reports Earnings Results for the Second Quarter Ended June 30, 2021	21-07-29	CI
Chipbond Technology Corporation Announces Cash Dividend Payable on August 13, 2021	21-07-02	CI

Chart Chipbond Technology Corporation

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Company Profile

Chipbond Technology Corp is a Taiwan-based company principally engaged in the research, development, manufacture, and distribution of electronic and semiconductor products, as well as the provision of related testing and assembling services. The Company provides products include gold bumps, solder bumps, chip on glass (COG), chip on film (COF) and flip chip and tape carrier packaging (TCP) products, among others. Its products are mainly used in the manufacture of computers, workstations, mobile phones, network products, air bag controllers, engine controlling components, automatic brake systems (ABSs), automobile air conditioners, digital cameras, watches, and liquid crystal display (LCD) monitors. The Company mainly distributes its products in Taiwan, the United States of America (the USA) and other regions.

Sector

Semiconductors

Calendar

09:00pm - Annual General Meeting

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Ratings for Chipbond Technology Corporation

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Analysts' Consensus

Sell

Buy

Mean consensus

UNDERPERFORM

Number of Analysts

Last Close Price

77.3 TWD

Average target price

64.84 TWD

Spread / Average Target

-16.12%

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